Inventor · disambiguated record

Chi Ping Hung

Also filed as: HUNG CHI PING

2 granted patents·2 citations·filing 2007–2012

34Inventor score

Technology areasG02B H10W

Files withASM ASSEMBLY AUTOMATION LTD1 HUNG KIN YIK1

Top patents by PatentIndex Score

2 records

0156US9281290B2Bond head for thermal compression die bondingHUNG KIN YIK·Filed 2012·Granted Mar 8, 2016·2 cites·13 claims
0234US7830597B2Optical system having selectable field for inspectionASM ASSEMBLY AUTOMATION LTD·Filed 2007·Granted Nov 9, 2010·0 cites·20 claims

Join the waitlist — get patent alerts

Get an alert when Chi Ping Hung files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →

Chi Ping Hung — Patent Inventor | PatentIndex