Inventor · disambiguated record
Chih-Chien Hung
Also filed as: HUNG CHIH-CHIEN
32 granted patents·6 pending applications·231 citations·filing 1996–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9FOXCONN TECH CO LTD5MEDIATEK INC5AMTRAN TECHNOLOGY CO LTD2DARFON ELECTRONICS CORP2
Top patents by PatentIndex Score
38 records- 0190US7989079B2Insert-molded cover and method for manufacturing sameFOXCONN TECH CO LTD·Filed 2008·Granted Aug 2, 2011·14 cites·7 claims
- 0284US8848462B2Low power memory controllersLUO YAN-BIN·Filed 2012·Granted Sep 30, 2014·11 cites·11 claims
- 0383US6006764AMethod of stripping photoresist from Al bonding pads that prevents corrosionTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Dec 28, 1999·73 cites·17 claims
- 0481US9432178B2Clock and data recovery circuit using an injection locked oscillatorMEDIATEK INC·Filed 2015·Granted Aug 30, 2016·4 cites·13 claims
- 0580US7936180B2Serial link transmitterMEDIATEK INC·Filed 2008·Granted May 3, 2011·9 cites·23 claims
- 0679US9833527B1Escalator sterilization deviceUNIV LUNGHWA SCI & TECHNOLOGY·Filed 2016·Granted Dec 5, 2017·6 cites·11 claims
- 0779US9525543B2Clock and data recovery circuit using an injection locked oscillatorMEDIATEK INC·Filed 2016·Granted Dec 20, 2016·3 cites·11 claims
- 0879US6340547B1Method of forming circuit patterns on semiconductor wafers using two optical steppers having nonaligned imaging systemsTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 22, 2002·18 cites·7 claims
- 0978US8747719B2Method for manufacturing insert-molded coverLEE HAN-MING·Filed 2011·Granted Jun 10, 2014·3 cites·8 claims
- 1072US7509615B2Circuit layout structure and methodREALTEK SEMICONDUCTOR CORP·Filed 2005·Granted Mar 24, 2009·5 cites·19 claims
- 1167US6361349B1High voltage connectorDARFON ELECTRONICS CORP·Filed 2000·Granted Mar 26, 2002·14 cites·13 claims
- 1266US12227864B2Additive compound for uniform dyeing after anodic oxidation, additive solution having the additive compound, and dyeing methodHONGFUJIN PREC ELECTR CHENGDU CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·9 claims
- 1366US2025059669A1Additive compound for uniform dyeing after anodic oxidation, additive solution having the additive compound, and dyeing methodHONGFUJIN PREC ELECTR CHENGDU CO LTD·Filed 2024·Application pending·0 cites
- 1464US10083728B2Memory controller, memory module and memory systemMEDIATEK INC·Filed 2014·Granted Sep 25, 2018·1 cites·19 claims
- 1563US5874309AMethod for monitoring metal corrosion on integrated circuit wafersTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Feb 23, 1999·20 cites·10 claims
- 1659US12426170B2Display device and positioning element thereofAMTRAN TECHNOLOGY CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1754US8138742B2Semiconductor circuits capable of mitigating unwanted effects caused by input signal variationsHWU SY-CHYUAN·Filed 2008·Granted Mar 20, 2012·3 cites·9 claims
- 1851US12353079B2Display deviceAMTRAN TECHNOLOGY CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·11 claims
- 1949US10333505B2Repetitive IO structure in a PHY for supporting C-PHY compatible standard and/or D-PHY compatible standardM31 TECH CORP·Filed 2017·Granted Jun 25, 2019·0 cites·20 claims
- 2047US7155831B2Ceramic cutting toolHON HAI PREC IND CO LTD·Filed 2004·Granted Jan 2, 2007·0 cites·5 claims
- 2147US2009278282A1Insert-molded cover and method for manufacturing sameFOXCONN TECH CO LTD·Filed 2008·Application pending·0 cites
- 2245US7402055B2Circuit board type connectorCHIEF LAND ELECTRONICS CO LTD·Filed 2007·Granted Jul 22, 2008·2 cites·10 claims
- 2345US2009280316A1Joining structure and insert-molded cover using sameFOXCONN TECH CO LTD·Filed 2008·Application pending·0 cites
- 2444US5641382AMethod to remove residue of metal etchTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jun 24, 1997·11 cites·24 claims
- 2543US2009267266A1Insert-molded cover and method for manufacturing sameFOXCONN TECH CO LTD·Filed 2008·Application pending·0 cites
- 2642US9665114B2Regulator applied on output terminal of power source to adjust adjusting current for increasing reference voltage when sensing decrease of reference voltage and decreasing reference voltage when sensing increase of reference voltage and regulating methodMEDIATEK INC·Filed 2013·Granted May 30, 2017·0 cites·21 claims
- 2741US8143877B2Semiconductor circuits capable of mitigating unwanted effects caused by input signal variationsHWU SY-CHYUAN·Filed 2010·Granted Mar 27, 2012·0 cites·9 claims
- 2841US6330355B1Frame layout to monitor overlay performance of chip composed of multi-exposure imagesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Dec 11, 2001·10 cites·22 claims
- 2941US2005013751A1Computer enclosure with photocatalyst deviceFiled 2004·Application pending·0 cites
- 3040US6261843B1Test pattern for monitoring metal corrosion on integrated circuit wafersTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Jul 17, 2001·6 cites·7 claims
- 3140US6186818B1High voltage connectorDARFON ELECTRONICS CORP·Filed 1998·Granted Feb 13, 2001·6 cites·4 claims
- 3239US2009265915A1Insert-molded cover and method for manufacturing sameFOXCONN TECH CO LTD·Filed 2008·Application pending·0 cites
- 3337US8952718B2Termination circuit and DC balance method thereofLUO YAN-BIN·Filed 2012·Granted Feb 10, 2015·0 cites·25 claims
- 3436US5998071AMethod to monitor lens heating effectsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 7, 1999·6 cites·18 claims
- 3532US8619932B2Signal transmission system with clock signal generator configured for generating clock signal having stepwise/smooth frequency transition and related signal transmission method thereofLIN YU-WEI·Filed 2011·Granted Dec 31, 2013·0 cites·20 claims
- 3632US7207722B2Combined bearingHON HAI PREC IND CO LTD·Filed 2003·Granted Apr 24, 2007·0 cites·1 claims
- 3730US6153497AMethod for determining a cause for defects in a film deposited on a waferTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 28, 2000·3 cites·18 claims
- 3829US6064475AReal time local defocus monitor system using maximum and mean angles of focus correctionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 16, 2000·3 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →