Inventor · disambiguated record
Chia-Lin Hung
Also filed as: HUNG CHIA-LIN
3 granted patents·2 pending applications·21 citations·filing 2010–2012
62Inventor score
Top patents by PatentIndex Score
5 records- 0190US8446000B2Package structure and package processSHEN CHI-CHIH·Filed 2010·Granted May 21, 2013·19 cites·23 claims
- 0259US8643167B2Semiconductor package with through silicon vias and method for making the sameHUNG CHIA-LIN·Filed 2011·Granted Feb 4, 2014·2 cites·20 claims
- 0334US2011300669A1Method for Making Die AssembliesSHEN CHI-CHIH·Filed 2010·Application pending·0 cites
- 0432US2013175324A1Thermal compression head for flip chip bondingCHANG HUI-SHAN·Filed 2012·Application pending·0 cites
- 0529US8976290B2Positionable mechanism with an optical image stabilizing unitCHEN TSUNG-TSE·Filed 2012·Granted Mar 10, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →