Inventor · disambiguated record
Chih-Pin Hung
Also filed as: HUNG CHIH-PIN
57 granted patents·13 pending applications·554 citations·filing 2000–2023
98Inventor score
Files withADVANCED SEMICONDUCTOR ENG64LIAO KUO-HSIEN2LIU SHEN-CHI1TAIWAN SEMICONDUCTOR MFG CO LTD1UNIV NAT SUN YAT SEN1
Top patents by PatentIndex Score
70 records- 0198US7989928B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Aug 2, 2011·113 cites·18 claims
- 0297US10276382B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 30, 2019·27 cites·46 claims
- 0397US8022511B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 20, 2011·81 cites·21 claims
- 0495US12431453B2Electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Sep 30, 2025·2 cites·20 claims
- 0594US11837566B2Electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 5, 2023·2 cites·16 claims
- 0694US8212339B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2010·Granted Jul 3, 2012·28 cites·20 claims
- 0793US11742324B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 29, 2023·2 cites·12 claims
- 0892US10535521B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 14, 2020·6 cites·47 claims
- 0992US7586184B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 8, 2009·29 cites·19 claims
- 1091US10886263B2Stacked semiconductor package assemblies including double sided redistribution layersADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 5, 2021·9 cites·20 claims
- 1191US8653633B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2011·Granted Feb 18, 2014·13 cites·20 claims
- 1290US11183474B2Electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 23, 2021·5 cites·24 claims
- 1390US10515806B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 24, 2019·5 cites·47 claims
- 1490US8350367B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jan 8, 2013·21 cites·24 claims
- 1589US10217649B2Semiconductor device package having an underfill barrierADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 26, 2019·9 cites·20 claims
- 1686US11011496B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·3 cites·17 claims
- 1785US10770369B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·5 cites·16 claims
- 1885US7576436B2Structure of wafer level package with area bumpADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 18, 2009·14 cites·19 claims
- 1983US11894317B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 6, 2024·2 cites·10 claims
- 2082US10522508B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 2181US12166009B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 2281US11777191B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 3, 2023·1 cites·8 claims
- 2381US7944707B2Package structure for connection with output/input moduleADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted May 17, 2011·10 cites·18 claims
- 2480US10181448B2Semiconductor devices and semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 15, 2019·3 cites·21 claims
- 2580US6825568B2Flip chip package structure and flip chip device with area bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 30, 2004·26 cites·7 claims
- 2679US7248134B2Inductor and capacitor formed of build-up viasADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 24, 2007·8 cites·6 claims
- 2778US10658257B1Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 19, 2020·2 cites·17 claims
- 2876US10916429B2Semiconductor device packages and stacked package assemblies including high density interconnectionsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 9, 2021·1 cites·48 claims
- 2975US10985085B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 20, 2021·2 cites·25 claims
- 3075US9917043B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 13, 2018·2 cites·17 claims
- 3175US6864588B2MCM package with bridge connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 8, 2005·23 cites·28 claims
- 3273US7060595B2Circuit substrate and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 13, 2006·22 cites·14 claims
- 3372US7256480B2Lead frame package structure with high density of lead pins arrangementADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 14, 2007·6 cites·7 claims
- 3471US9917071B1Semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Mar 13, 2018·2 cites·20 claims
- 3570US6430059B1Integrated circuit package substrate integrating with decoupling capacitorADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Aug 6, 2002·18 cites·16 claims
- 3668US12132248B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 29, 2024·0 cites·17 claims
- 3767US6974334B2Semiconductor package with connectorADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 13, 2005·22 cites·17 claims
- 3866US10600759B2Power and ground design for through-silicon via structureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 24, 2020·1 cites·23 claims
- 3962US8000107B2Carrier with embedded component and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Aug 16, 2011·2 cites·20 claims
- 4058US10658319B2Semiconductor devices and semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 4157US6927480B2Multi-chip package with electrical interconnectionADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 9, 2005·12 cites·20 claims
- 4255US12300715B2Capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4353US11621220B2Assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·0 cites·17 claims
- 4453US11217502B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 4553US10541198B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 4652US2024170364A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4751US6833610B2Bridge connection type of chip package and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 21, 2004·4 cites·24 claims
- 4850US11227823B2Wiring structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 4950US10553527B2Substrate and semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 4, 2020·0 cites·25 claims
- 5048US11139222B2Electronic device comprising heat pipe contacting a cover structure for heat dissipationADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →