Inventor · disambiguated record
Chan Ha Hwang
Also filed as: HWANG CHAN HA
5 granted patents·82 citations·filing 2007–2015
77Inventor score
Top patents by PatentIndex Score
5 records- 0195US8026589B1Reduced profile stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2009·Granted Sep 27, 2011·67 cites·25 claims
- 0277US8487420B1Package in package semiconductor device with film over wireHWANG CHAN HA·Filed 2008·Granted Jul 16, 2013·10 cites·18 claims
- 0365US8198738B1Structure of bond pad for semiconductor die and method thereforHWANG CHAN HA·Filed 2007·Granted Jun 12, 2012·4 cites·23 claims
- 0459US9627348B2Laser assisted bonding for semiconductor die interconnectionsAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·1 cites·17 claims
- 0544US9513254B2Microfluidic sensor package structure and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Dec 6, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →