Inventor · disambiguated record
Chang-Seong Jeon
Also filed as: JEON CHANG-SEONG
10 granted patents·6 pending applications·62 citations·filing 2008–2019
87Inventor score
Top patents by PatentIndex Score
16 records- 0194US9461029B2Semiconductor packages and methods for fabricating the sameJANG HYE-YOUNG·Filed 2015·Granted Oct 4, 2016·17 cites·20 claims
- 0288US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 0386US9177942B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 3, 2015·9 cites·13 claims
- 0486US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 0585US9245787B2Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the sameJEON CHANG-SEONG·Filed 2012·Granted Jan 26, 2016·10 cites·18 claims
- 0678US8697494B2Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodJEON CHANG-SEONG·Filed 2011·Granted Apr 15, 2014·5 cites·13 claims
- 0771US10867857B2Method of cutting substrate and method of singulating semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·14 claims
- 0870US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 0951US2010105169A1Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2009·Application pending·0 cites
- 1051US2014196280A1Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1150US8987904B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·13 claims
- 1246US2016372447A1Semiconductor packages and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1345US9082871B2Substrate of semiconductor package and method of fabricating semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 14, 2015·0 cites·10 claims
- 1443US2009278561A1Probe card having redistributed wiring probe needle structure and probe card module using the sameJO CHA-JEA·Filed 2008·Application pending·0 cites
- 1538US2013149817A1Fabricating methods of semiconductor devices and pick-up apparatuses of semiconductor devices thereinJEON CHANG-SEONG·Filed 2012·Application pending·0 cites
- 1632US2012077314A1Method of fabricating semiconductor stack packagePARK SANG-SICK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →