Inventor · disambiguated record
Changyou Jing
Also filed as: JING CHANGYOU
8 granted patents·4 pending applications·5 citations·filing 2017–2025
77Inventor score
Files withLAM RES CORP12
Top patents by PatentIndex Score
12 records- 0190US11823875B2Real-time control of temperature in a plasma chamberLAM RES CORP·Filed 2021·Granted Nov 21, 2023·2 cites·14 claims
- 0278US11087962B2Real-time control of temperature in a plasma chamberLAM RES CORP·Filed 2018·Granted Aug 10, 2021·2 cites·26 claims
- 0371US2025054788A1Identification of and compensation for a failure in a heater arrayLAM RES CORP·Filed 2024·Application pending·0 cites
- 0470US2025069866A1In situ real-time sensing and compensation of non-uniformities in substrate processing systemsLAM RES CORP·Filed 2024·Application pending·0 cites
- 0569US10306776B1Substrate processing system printed-circuit control board assembly with one or more heater layersLAM RES CORP·Filed 2017·Granted May 28, 2019·1 cites·19 claims
- 0666US2025279298A1Rf immune sensor probe for monitoring a temperature of an electrostatic chuck of a substrate processing systemLAM RES CORP·Filed 2025·Application pending·0 cites
- 0757US12308265B2RF immune sensor probe for monitoring a temperature of an electrostatic chuck of a substrate processing systemLAM RES CORP·Filed 2020·Granted May 20, 2025·0 cites·23 claims
- 0857US12165891B2Identification of and compensation for a failure in a heater arrayLAM RES CORP·Filed 2019·Granted Dec 10, 2024·0 cites·16 claims
- 0955US12142464B2In situ real-time sensing and compensation of non-uniformities in substrate processing systemsLAM RES CORP·Filed 2020·Granted Nov 12, 2024·0 cites·17 claims
- 1048US11901944B2Power and data transmission to substrate support in plasma chambers via optical fiberLAM RES CORP·Filed 2020·Granted Feb 13, 2024·0 cites·24 claims
- 1146US12444570B2Electrostatic chuck heater resistance measurement to approximate temperatureLAM RES CORP·Filed 2020·Granted Oct 14, 2025·0 cites·27 claims
- 1235US2022013388A1Pin-lifter test substrateLAM RES CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →