Inventor · disambiguated record
Chajea Jo
Also filed as: JO CHAJEA
35 granted patents·21 pending applications·215 citations·filing 2009–2025
96Inventor score
Top patents by PatentIndex Score
56 records- 0197US8802495B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 12, 2014·87 cites·21 claims
- 0295US11444060B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 0394US9461029B2Semiconductor packages and methods for fabricating the sameJANG HYE-YOUNG·Filed 2015·Granted Oct 4, 2016·17 cites·20 claims
- 0493US11923342B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 5, 2024·2 cites·19 claims
- 0592US11848293B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·19 claims
- 0692US10361170B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 23, 2019·11 cites·18 claims
- 0792US8026592B2Through-silicon via structures including conductive protective layersSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·45 cites·18 claims
- 0891US12327784B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 10, 2025·2 cites·20 claims
- 0986US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 1084US10186500B2Semiconductor package and method of fabricating the sameRYU SEUNG KWAN·Filed 2016·Granted Jan 22, 2019·6 cites·16 claims
- 1182US11545417B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·1 cites·20 claims
- 1282US10121731B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 6, 2018·4 cites·19 claims
- 1381US9875992B2Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the sameHEO JUNYEONG·Filed 2015·Granted Jan 23, 2018·6 cites·15 claims
- 1479US11152416B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·18 claims
- 1578US11335719B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 1677US10510737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·12 claims
- 1776US10192855B2Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting lineSEO SUNKYOUNG·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 1875US12400980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 1972US11990452B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 21, 2024·0 cites·18 claims
- 2072US10985152B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 2171US11887913B2Integrated circuit device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 2271US11824076B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·19 claims
- 2371US10651224B2Semiconductor package including a redistribution lineSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·19 claims
- 2471US8129840B2Semiconductor package and methods of manufacturing the sameJO CHAJEA·Filed 2009·Granted Mar 6, 2012·8 cites·19 claims
- 2570US2025273554A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2669US10978431B2Semiconductor package with connection substrate and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·1 cites·18 claims
- 2768US11600608B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 2868US11569201B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2964US11626385B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 3059US2025022828A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3159US2024429192A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3258US2025149479A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3356US2024355780A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3455US2025096047A1Semiconductor package and method of testing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3555US2024055406A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3655US2025096208A1Semiconductor package having dielectric layer with step differenceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3754US11158603B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 3854US10734367B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 3954US2024243111A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4054US2024113057A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4153US2024162188A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4253US2024170464A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4351US2024194575A1Semiconductor package including semiconductor chip having through-electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4451US2019259733A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4551US2023138813A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4650US11776941B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 4749US11942446B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·19 claims
- 4848US11545512B2Image sensor package with underfill and image sensor module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·18 claims
- 4947US9355961B2Semiconductor devices having through-electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 31, 2016·0 cites·21 claims
- 5047US2025372537A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →