Inventor · disambiguated record
Chia-Ling Kao
Also filed as: KAO CHIA-LING
11 granted patents·3 pending applications·227 citations·filing 2008–2023
88Inventor score
Technology areasH10P
Top patents by PatentIndex Score
14 records- 0198US8895449B1Delicate dry cleanAPPLIED MATERIALS INC·Filed 2013·Granted Nov 25, 2014·182 cites·17 claims
- 0294US8992792B2Method of fabricating an ultra low-k dielectric self-aligned viaAPPLIED MATERIALS INC·Filed 2012·Granted Mar 31, 2015·20 cites·8 claims
- 0387US9006106B2Method of removing a metal hardmaskKAO CHIA-LING·Filed 2013·Granted Apr 14, 2015·9 cites·18 claims
- 0486US10170336B1Methods for anisotropic control of selective silicon removalAPPLIED MATERIALS INC·Filed 2017·Granted Jan 1, 2019·4 cites·20 claims
- 0578US8987139B2Method of patterning a low-k dielectric filmKAO CHIA-LING·Filed 2014·Granted Mar 24, 2015·4 cites·20 claims
- 0673US7981812B2Methods for forming ultra thin structures on a substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jul 19, 2011·4 cites·20 claims
- 0771US10872778B2Systems and methods utilizing solid-phase etchantsAPPLIED MATERIALS INC·Filed 2018·Granted Dec 22, 2020·1 cites·20 claims
- 0871US9299577B2Methods for etching a dielectric barrier layer in a dual damascene structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·2 cites·18 claims
- 0965US9514953B2Methods for barrier layer removalAPPLIED MATERIALS INC·Filed 2014·Granted Dec 6, 2016·1 cites·20 claims
- 1056US12334358B2Integration processes utilizing boron-doped silicon materialsAPPLIED MATERIALS INC·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 1156US2024290623A1Processing methods to improve etched silicon-and-germanium-containing material surface roughnessAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1249US10755941B2Self-limiting selective etching systems and methodsAPPLIED MATERIALS INC·Filed 2018·Granted Aug 25, 2020·0 cites·19 claims
- 1345US2009293907A1Method of substrate polymer removalFUNG NANCY·Filed 2008·Application pending·0 cites
- 1442US2015064921A1Low temperature plasma anneal process for sublimative etch processesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →