Inventor · disambiguated record
Chih-Kuang Kao
Also filed as: KAO CHIH-KUANG
10 granted patents·6 pending applications·19 citations·filing 1996–2025
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13KAO CHIH-KUANG1TAIWAN SEMICONDUCTOR MFG1UNITED MICROELECTRONICS CORP1
Top patents by PatentIndex Score
16 records- 0186US9112004B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 18, 2015·7 cites·20 claims
- 0280US8653663B2Barrier layer for copper interconnectKAO CHIH-KUANG·Filed 2010·Granted Feb 18, 2014·7 cites·19 claims
- 0380US2024371746A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0479US12125782B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0578US2025357076A1Method and apparatus for preparing samples for imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0674US10867903B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 0771US11978764B2Semiconductor structure and method for manufacturing capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0871US10763325B2Capacitor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·20 claims
- 0970US11587863B2Semiconductor structure and method of forming semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 1070US2024369626A1Array of unit cells having pad structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1168US11362169B2Capacitor structure and semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1268US2024038486A1Method and apparatus for preparing samples for imagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1365US12123909B2Array of unit cells having pad structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1458US2025357223A1Semiconductor structure with testline and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1550US2024038605A1Semiconductor structure with testline and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1629US5802108AWaveform correction apparatusUNITED MICROELECTRONICS CORP·Filed 1996·Granted Sep 1, 1998·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →