Inventor · disambiguated record
Chung Hyeon Kim
Also filed as: KIM CHUNG HYEON
1 granted patent·2 pending applications·0 citations·filing 2009–2021
1Inventor score
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3 records- 0141US2022386479A1Batch joining type multi-layer printed circuit board and manufacturing method of the sameTSE CO LTD·Filed 2021·Application pending·0 cites
- 0239US12108544B2Multi-layer printed circuit board made of different materials and manufacturing method thereofTSE CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·7 claims
- 0335US2011191124A1Rfid-based system for linking electronic medical recordSUNG MYUNG-WHUN·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →