Inventor · disambiguated record
Choo-Ho Kim
Also filed as: KIM CHOO-HO
14 granted patents·8 pending applications·71 citations·filing 2005–2017
89Inventor score
Top patents by PatentIndex Score
22 records- 0194US8922643B2Apparatus for inspecting light emitting diode and inspecting method using said apparatusJI WON SOO·Filed 2012·Granted Dec 30, 2014·35 cites·15 claims
- 0287US8815616B2Slit valve unit and film forming apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·11 cites·17 claims
- 0377US8852971B2Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered objectKIM EUI-SEOK·Filed 2012·Granted Oct 7, 2014·3 cites·7 claims
- 0477US7650687B2Die attaching apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 26, 2010·7 cites·14 claims
- 0576US9543221B2Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirementSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
- 0673US9463479B2Phosphor dispenserSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 11, 2016·5 cites·20 claims
- 0770US8927302B2Chemical vapor deposition apparatus and method for manufacturing light-emitting devices using sameKIM JUN WOO·Filed 2011·Granted Jan 6, 2015·4 cites·16 claims
- 0862US9347772B2Apparatus for measurement of three-dimensional shapeSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 24, 2016·2 cites·4 claims
- 0954US9627279B2Method for removing defective light emitting diode (LED) package from LED package arrarySAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 18, 2017·0 cites·10 claims
- 1054US8791497B2Mold for light-emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jul 29, 2014·1 cites·16 claims
- 1151US8860073B2Light-emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 14, 2014·0 cites·18 claims
- 1245US10217680B2Test apparatus and manufacturing apparatus of light emitting device packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 26, 2019·0 cites·20 claims
- 1345US2012122250A1Apparatus and method for manufacturing led packageJI WON SOO·Filed 2011·Application pending·0 cites
- 1444US2014130732A1Wafer holder cleaning apparatus and film deposition system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1543US8809189B2Method of forming through-silicon via using laser ablationSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Aug 19, 2014·0 cites·16 claims
- 1642US2014017837A1Method of cutting silicon substrate having light-emitting element packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1739US2013193131A1Optical pyrometer and apparatus for processing semiconductor by employing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1839US2015251228A1Wafer holder cleaning apparatus and film deposition system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1937US2012249776A1Light-emitting device inspecting apparatus and methodJI WON-SOO·Filed 2012·Application pending·0 cites
- 2034US2006266792A1Multi-chip die bonder and methodKO YOUN-SUNG·Filed 2005·Application pending·0 cites
- 2132US2017125647A1Light-emitting diode package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2226US9109154B2Apparatus and method for automatically mixing phosphorNOH MYEONG HO·Filed 2011·Granted Aug 18, 2015·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →