Apparatus and method for manufacturing led package

Abstract

An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

1 . An apparatus for manufacturing a light emitting diode (LED) package, the apparatus comprising:
 a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame;   a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and   a cutting unit cutting an LED package determined to be a functional product or an LED package determined to be a defective product according to the testing results of the testing unit so as to be removed from the lead frame.   
     
     
         2 . The apparatus of  claim 1 , wherein the heating unit comprises:
 a low temperature heating unit heating the LED package array in a first temperature range; and   a high temperature heating unit heating the LED package array, which has been heated by the low temperature heating unit, in a second temperature range higher than the first temperature range.   
     
     
         3 . The apparatus of  claim 1 , wherein the heating unit heats the LED package array as a testing target to 80° C. to 300° C. 
     
     
         4 . The apparatus of  claim 1 , wherein the heating unit heat the LED package array as a testing target to 180° C. to 250° C. 
     
     
         5 . The apparatus of  claim 1 , wherein the testing unit comprises a multi-probe pin array for simultaneously applying a driving voltage or current to the plurality of LED packages in the LED package array. 
     
     
         6 . The apparatus of  claim 1 , wherein the testing unit tests the operational state of the LED package by simultaneously applying a driving voltage or current to the plurality of LED packages in the LED package array. 
     
     
         7 . The apparatus of  claim 1 , wherein the testing unit tests whether or not each of the LED packages is open or short or lighted by applying a driving voltage or current to the plurality of LED packages in the LED package array. 
     
     
         8 . The apparatus of  claim 1 , wherein the testing unit further comprises:
 a camera for checking whether or not each of the LED packages in the LED package array is lighted.   
     
     
         9 . The apparatus of  claim 1 , further comprising:
 a loading unit supplying a testing target LED package array from the exterior to the heating unit; and   an unloading unit unloading the LED package array from the cutting unit.   
     
     
         10 . A method for manufacturing a light emitting diode (LED) package, the method comprising:
 preparing an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame;   heating the LED package array;   testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and   cutting an LED package determined to be a functional product or an LED package determined to be a defective product according to the operational state testing results so as to be removed from the lead frame.   
     
     
         11 . The method of  claim 10 , further comprising:
 inspecting an external appearance of the LED package array before heating the LED package array.   
     
     
         12 . The method of  claim 10 , wherein the heating of the LED package array comprises:
 a low temperature heating operation of heating the LED package array in a first temperature range; and   a high temperature heating operation of heating the LED package array, which has been heated in the low temperature heating step, in a second temperature range higher than the first temperature range.   
     
     
         13 . The method of  claim 10 , wherein, in the heating of the LED package array, the LED package array as a testing target is heated to 80° C. to 300° C. 
     
     
         14 . The method of  claim 10 , wherein, in the heating of the LED package array, the LED package array as a testing target is heated to 180° C. to 250° C. 
     
     
         15 . The method of  claim 10 , wherein, in the testing of the operational state of the LED packages, the operational state of the LED packages in the LED package array is tested by simultaneously applying a driving voltage or current to the plurality of LED packages through a multi-probe pin array. 
     
     
         16 . The method of  claim 10 , wherein, in the testing of the operational state of the LED packages, the operational state of the LED packages in the LED package array is tested by simultaneously applying a driving voltage or current to the plurality of LED packages. 
     
     
         17 . The method of  claim 10 , wherein, in the testing of the operational state of the LED packages, whether or not the respective LED packages are open or short or lighted is tested by simultaneously applying a driving voltage or current to the plurality of LED packages. 
     
     
         18 . The method of  claim 10 , wherein, in the testing of the operational state of the LED packages, whether or not the respective LED packages in the LED package array are lighted is tested by using a camera. 
     
     
         19 . The method of  claim 10 , further comprising:
 a loading operation of supplying the testing target LED package array to a heating unit from the exterior; and   an unloading operation of unloading the LED package array which has undergone a cutting and removing step.   
     
     
         20 . The method of  claim 10 , wherein each of the LED packages in the LED package array as a testing target is a package which has completely undergone a transparent resin applying process and a transparent resin curing process.