Inventor · disambiguated record
Chulsik Kim
Also filed as: KIM CHULSIK
5 granted patents·1 pending application·28 citations·filing 2004–2011
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0185US7909233B2Method of manufacturing a semiconductor package with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2010·Granted Mar 22, 2011·7 cites·10 claims
- 0279US7731078B2Semiconductor system with fine pitch lead fingersSTATS CHIPPAC LTD·Filed 2005·Granted Jun 8, 2010·7 cites·10 claims
- 0367US7407080B2Wire bond capillary tipCHIPPAC INC·Filed 2004·Granted Aug 5, 2008·14 cites·18 claims
- 0449US8256660B2Semiconductor package system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Sep 4, 2012·0 cites·21 claims
- 0545US8519517B2Semiconductor system with fine pitch lead fingers and method of manufacturing thereofLEE HUN TEAK·Filed 2011·Granted Aug 27, 2013·0 cites·10 claims
- 0640US2007001296A1Bump for overhang deviceSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →