Inventor · disambiguated record
Chin-Yu Ku
Also filed as: KU CHIN J · KU CHIN-YU
59 granted patents·10 pending applications·138 citations·filing 2000–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD63VANGUARD INT SEMICONDUCT CORP2CHENG YI P1LII MIRNG-JI1SILICONWARE PRECISION INDUSTRIES CO LTD1
Top patents by PatentIndex Score
69 records- 0196US8048778B1Methods of dicing a semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·36 cites·20 claims
- 0294US10276514B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·14 cites·18 claims
- 0393US10868106B2Semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·5 cites·20 claims
- 0493US10720487B2Structure and formation method of semiconductor device with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·6 cites·20 claims
- 0591US11749711B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·1 cites·20 claims
- 0690US11348879B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 0790US10756162B2Structure and formation method of semiconductor device with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·3 cites·20 claims
- 0889US11621317B2Semiconductor device structure with magnetic element covered by polymer materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 0989US2025301673A1Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1089US2024363676A1Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1188US9837366B1Semicondcutor structure and semiconductor manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·7 cites·20 claims
- 1286US12376317B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1385US10818612B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 1485US9935047B2Bonding structures and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·4 cites·20 claims
- 1585US2025353735A1Mems structure with reduced peeling and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1684US12074193B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1783US10535593B2Package structure having a plurality of conductive balls with narrow width for ball waistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·3 cites·20 claims
- 1882US10163849B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1982US9058971B2Electro-optical moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jun 16, 2015·7 cites·23 claims
- 2081US10263064B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 16, 2019·3 cites·20 claims
- 2179US12500149B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 2279US12209013B2Arched membrane structure for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 2379US2024297138A1Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2478US10163781B1Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 2577US12347722B2Semiconductor device structure with a protection cap at an end portion of a conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 2677US12266593B2Method of forming semiconductor device having at least one via including concave portions on sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2777US2024383744A1Arched membrane structure for mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2876US11855007B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2975US11984419B2Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 3075US11908885B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 3175US11557508B2Semiconductor device structure having protection caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 3275US10276481B2Package structure having a plurality of conductive balls having narrow width for the ball waistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·19 claims
- 3375US10269703B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 3474US11233116B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 3574US10741513B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 3673US2025210467A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3772US11081459B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 3872US2024034619A1MEMS Structure with Reduced Peeling and Methods Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3971US10483226B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·1 cites·14 claims
- 4071US10115686B2Semiconductor structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·2 cites·20 claims
- 4170US11329124B2Semiconductor device structure with magnetic elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 4270US11069652B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 4369US12134557B2Arched membrane structure for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 4469US11942398B2Semiconductor device having at least one via including concave portions on sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 4569US11769716B2Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 4669US11594484B2Forming bonding structures by using template layer as templatesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·20 claims
- 4769US11527504B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 4868US11469203B2Method for forming package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 4968US11094776B2Structure and formation method of semiconductor device with magnetic element covered by polymer materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 5067US6338926B1Focus measurement methodVANGUARD INT SEMICONDUCT CORP·Filed 2000·Granted Jan 15, 2002·13 cites·6 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →