Inventor · disambiguated record
Chen-Yueh Kung
Also filed as: KUNG CHEN-YUEH
22 granted patents·7 pending applications·214 citations·filing 2002–2024
94Inventor score
Top patents by PatentIndex Score
29 records- 0192US10204852B2Circuit substrate and semiconductor package structureVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 12, 2019·8 cites·9 claims
- 0292US7087991B2Integrated circuit package and method of manufactureVIA TECH INC·Filed 2002·Granted Aug 8, 2006·83 cites·26 claims
- 0391US6977348B2High density laminated substrate structure and manufacture method thereofVIA TECH INC·Filed 2002·Granted Dec 20, 2005·54 cites·7 claims
- 0487US9497864B2Circuit substrate, semiconductor package and process for fabricating the sameVIA TECH INC·Filed 2013·Granted Nov 15, 2016·8 cites·12 claims
- 0584US10014246B2Circuit substrate, semiconductor package and process for fabricating the sameVIA TECH INC·Filed 2016·Granted Jul 3, 2018·4 cites·11 claims
- 0681US6779783B2Method and structure for tape ball grid array packageVIA TECH INC·Filed 2002·Granted Aug 24, 2004·39 cites·38 claims
- 0778US10184956B2Probe cardVIA TECH INC·Filed 2018·Granted Jan 22, 2019·1 cites·6 claims
- 0875US9786588B2Circuit substrate and package structureVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2015·Granted Oct 10, 2017·4 cites·30 claims
- 0974US9905519B1Electronic structure processVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 27, 2018·2 cites·14 claims
- 1073US9066458B2Fabricating method of circuit board and circuit boardKUNG CHEN-YUEH·Filed 2012·Granted Jun 23, 2015·4 cites·21 claims
- 1170US8302298B2Process for fabricating circuit substrateKUNG CHEN-YUEH·Filed 2010·Granted Nov 6, 2012·2 cites·10 claims
- 1269US9425066B2Circuit substrateVIA TECH INC·Filed 2012·Granted Aug 23, 2016·2 cites·18 claims
- 1366US10459007B2Probe cardVIA TECH INC·Filed 2018·Granted Oct 29, 2019·0 cites·5 claims
- 1464US9324580B2Process for fabricating a circuit substrateVIA TECH INC·Filed 2015·Granted Apr 26, 2016·1 cites·8 claims
- 1563US2025149431A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2024·Application pending·0 cites
- 1659US8549745B2Fabricating process of circuit substrateKUNG CHEN-YUEH·Filed 2010·Granted Oct 8, 2013·1 cites·7 claims
- 1759US2024421124A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2023·Application pending·0 cites
- 1859US2024421096A1Manufacturing method of electronic package and electronic packageVIA TECH INC·Filed 2023·Application pending·0 cites
- 1956US10119995B2Probe cardVIA TECH INC·Filed 2014·Granted Nov 6, 2018·0 cites·2 claims
- 2056US8261436B2Fabricating process of circuit substrateKUNG CHEN-YUEH·Filed 2009·Granted Sep 11, 2012·1 cites·11 claims
- 2155US2013025926A1Circuit substrateVIA TECH INC·Filed 2012·Application pending·0 cites
- 2253US10573614B2Process for fabricating a circuit substrateVIA TECH INC·Filed 2018·Granted Feb 25, 2020·0 cites·5 claims
- 2353US2012267155A1Circuit substrateKUNG CHEN-YUEH·Filed 2012·Application pending·0 cites
- 2452US9532467B2Circuit substrateVIA TECH INC·Filed 2013·Granted Dec 27, 2016·0 cites·9 claims
- 2551US10103115B2Circuit substrate and semicondutor package structureVIA TECH INC·Filed 2013·Granted Oct 16, 2018·0 cites·13 claims
- 2651US2009296330A1Electronic apparatusVIA TECH INC·Filed 2009·Application pending·0 cites
- 2749US9601425B2Circuit substrate and semiconductor package structureVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2015·Granted Mar 21, 2017·0 cites·11 claims
- 2845US10002839B2Electronic structure, and electronic structure arrayVIA ALLIANCE SEMICONDUCTOR CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·21 claims
- 2937US2003222352A1Under-bump metallugical structureVIA TECH INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →