Circuit substrate

Abstract

A circuit substrate includes a base layer, a patterned conductive layer, a dielectric layer, an outer pad and a conductive block. The patterned conductive layer is disposed on the base layer and has an inner pad. The dielectric layer is disposed on the base layer and covers the patterned conductive layer. The outer pad is disposed on the dielectric layer. The conductive layer is passed through the dielectric layer and connected between the outer pad and the inner pad, wherein the outer pad and the conductive block are formed as an integrative unit, and an outer diameter of the outer pad is substantially equal to an outer diameter of the conductive block.

1 . A circuit substrate, comprising:
 a base layer;   a patterned conductive layer, disposed on the base layer and having an inner pad;   a dielectric layer, disposed on the base layer and covering the patterned conductive layer;   an outer pad, disposed on the dielectric layer; and   a conductive block, penetrating the dielectric layer and connected between the outer pad and the inner pad, wherein the outer pad and the conductive block are formed as an integrative unit.   
     
     
         2 . The circuit substrate as claimed in  claim 1 , wherein an outer diameter of the inner pad is smaller than an outer diameter of the conductive block, such that the inner pad is encapsulated by the conductive block. 
     
     
         3 . The circuit substrate as claimed in  claim 2 , wherein the patterned conductive layer further comprises an inner conductive line, and one terminal of the inner conductive line constitutes the inner pad. 
     
     
         4 . The circuit substrate as claimed in  claim 2 , wherein an outer diameter of the outer pad substantially equals to an outer diameter of the conductive block, such that the inner pad, the conductive block, and the outer pad form a profile of “rectangle”-shape on a cross-section. 
     
     
         5 . The circuit substrate as claimed in  claim 2 , wherein an outer diameter of the outer pad is larger than an outer diameter of the conductive block, such that the inner pad, the conductive block, and the outer pad form a profile of “T”-shape on a cross-section. 
     
     
         6 . The fabricating process of the circuit substrate as claimed in  claim 1 , wherein an outer diameter of the inner pad is larger than an outer diameter of the conductive block. 
     
     
         7 . The circuit substrate as claimed in  claim 6 , wherein an outer diameter of the outer pad substantially equals to an outer diameter of the conductive block, such that the inner pad, the conductive block, and the outer pad form a profile of inverted “T”-shape on a cross-section. 
     
     
         8 . The circuit substrate as claimed in  claim 6 , wherein an outer diameter of the outer pad is larger than an outer diameter of the conductive block, such that the inner pad, the conductive block, and the outer pad form a profile of “I”-shape on a cross-section. 
     
     
         9 . The circuit substrate as claimed in  claim 1 , wherein the outer pad protrudes over the dielectric layer in a curve and the portion of the dielectric layer surrounding the outer pad concaves relative to other portions of the dielectric layer.