Inventor · disambiguated record
Chien-Li Kuo
Also filed as: KUO CHIEN-LI
116 granted patents·45 pending applications·999 citations·filing 1997–2025
99Inventor score
Files withUNITED MICROELECTRONICS CORP81TAIWAN SEMICONDUCTOR MFG CO LTD53KUO CHIEN-LI16LIN YUNG-CHANG2Chen jia-jia1
Top patents by PatentIndex Score
161 records- 0196US12002774B2Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0296US11444046B2Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·3 cites·20 claims
- 0396US10276651B2Low warpage high density trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·15 cites·20 claims
- 0496US8525296B1Capacitor structure and method of forming the sameLIN YUNG-CHANG·Filed 2012·Granted Sep 3, 2013·27 cites·8 claims
- 0595US11515398B2Thin poly field plate designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·4 cites·20 claims
- 0695US11374107B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·19 claims
- 0795US7846837B2Through substrate via processUNITED MICROELECTRONICS CORP·Filed 2008·Granted Dec 7, 2010·41 cites·11 claims
- 0895US7387950B1Method for forming a metal structureUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 17, 2008·31 cites·10 claims
- 0994US10312207B2Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 4, 2019·7 cites·20 claims
- 1094US9941384B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 10, 2018·8 cites·20 claims
- 1194US9275933B2Semiconductor deviceKUO CHIEN-LI·Filed 2012·Granted Mar 1, 2016·16 cites·15 claims
- 1294US8916471B1Method for forming semiconductor structure having through silicon via for signal and shielding structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 23, 2014·35 cites·19 claims
- 1392US10163707B2Method for forming group III-V device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·10 cites·20 claims
- 1492US9123789B2Chip with through silicon via electrode and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·12 cites·8 claims
- 1592US8519515B2TSV structure and method for forming the sameKUO CHIEN-LI·Filed 2011·Granted Aug 27, 2013·21 cites·21 claims
- 1692US7256475B2On-chip test circuit for assessing chip integrityUNITED MICROELECTRONICS CORP·Filed 2005·Granted Aug 14, 2007·24 cites·8 claims
- 1791US2025343181A1Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1890US7671355B2Method of fabricating a phase change memory and phase change memoryUNITED MICROELECTRONICS CORP·Filed 2008·Granted Mar 2, 2010·23 cites·19 claims
- 1989US12512331B2Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·20 claims
- 2089US7715260B1Operating voltage tuning method for static random access memoryUNITED MICROELECTRONICS CORP·Filed 2008·Granted May 11, 2010·41 cites·12 claims
- 2188US12424573B2Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 2288US10804231B2Passivation scheme for pad openings and trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·3 cites·20 claims
- 2388US10199273B2Method for forming semiconductor device with through silicon viaUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·5 cites·6 claims
- 2487US9704841B2Method of packaging stacked dies on wafer using flip-chip bondingUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 11, 2017·8 cites·15 claims
- 2586US9666507B2Through-substrate structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 30, 2017·7 cites·12 claims
- 2685US9012324B2Through silicon via processChen jia-jia·Filed 2012·Granted Apr 21, 2015·11 cites·15 claims
- 2785US6403417B1Method for in-situ fabrication of a landing via and a strip contact in an embedded memoryUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jun 11, 2002·42 cites·18 claims
- 2884US8227889B2Semiconductor deviceKUO CHIEN-LI·Filed 2008·Granted Jul 24, 2012·10 cites·20 claims
- 2984US8168533B2Through-silicon via structure and method for making the sameKUO CHIEN-LI·Filed 2011·Granted May 1, 2012·6 cites·11 claims
- 3083US12100754B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 3183US7332392B2Trench-capacitor DRAM device and manufacture method thereofUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 19, 2008·11 cites·19 claims
- 3283US2025240981A1Low warpage high density trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3383US2024387576A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3482US12272725B2Low warpage high density trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 3581US12119237B2Semiconductor device package having metal thermal interface materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 3681US6406968B1Method of forming dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jun 18, 2002·33 cites·18 claims
- 3781US6395596B1Method of fabricating a MOS transistor in an embedded memoryUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 28, 2002·30 cites·17 claims
- 3881US6046081AMethod for forming dielectric layer of capacitorUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 4, 2000·57 cites·7 claims
- 3981US2025364521A1Method of forming integrated circuit packages by bonding package component having first carrier to package substrate having second carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4080US12288794B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 4180US8026573B2Electrical fuse structureUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 27, 2011·9 cites·18 claims
- 4280US7176555B1Flip chip package with reduced thermal stressUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 13, 2007·9 cites·11 claims
- 4380US6248623B1Method for manufacturing embedded memory with different spacer widthsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 19, 2001·46 cites·22 claims
- 4480US2025364353A1Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US12027603B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 4679US11664398B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 30, 2023·1 cites·15 claims
- 4779US9123730B2Semiconductor device having through silicon trench shielding structure surrounding RF circuitUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 1, 2015·5 cites·19 claims
- 4879US6461959B1Method of fabrication of a contact plug in an embedded memoryUNITED MICROELECTRONICS CORP·Filed 2001·Granted Oct 8, 2002·29 cites·16 claims
- 4979US2025349670A1Semiconductor Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5079US2024371656A1Method for forming semiconductor device package having metal thermal interface materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 161 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →