Inventor · disambiguated record
Chung-Hsing Kuo
Also filed as: KUO CHUNG-HSING
12 granted patents·5 pending applications·35 citations·filing 2014–2023
87Inventor score
Top patents by PatentIndex Score
17 records- 0196US11450633B2Package structure of semiconductor device with improved bonding between the substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 20, 2022·6 cites·10 claims
- 0293US11164822B1Structure of semiconductor device and method for bonding two substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 2, 2021·3 cites·21 claims
- 0392US10199697B2Sealed battery pack designsFORD GLOBAL TECH LLC·Filed 2016·Granted Feb 5, 2019·6 cites·18 claims
- 0489US11912123B2Traction battery pack venting system and venting methodFORD GLOBAL TECH LLC·Filed 2021·Granted Feb 27, 2024·2 cites·19 claims
- 0586US9440555B2Battery pack thermal managementFORD GLOBAL TECH LLC·Filed 2014·Granted Sep 13, 2016·12 cites·5 claims
- 0680US9738176B2Battery pack thermal managementFORD GLOBAL TECH LLC·Filed 2016·Granted Aug 22, 2017·3 cites·13 claims
- 0773US10446887B2Battery thermal management system including thermal interface material with integrated heater elementFORD GLOBAL TECH LLC·Filed 2014·Granted Oct 15, 2019·1 cites·19 claims
- 0872US10192808B1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·2 cites·17 claims
- 0969US12148723B2Structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 1065US2022384376A1Package structure of semiconductor device with improved bonding between the substratesUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1165US2024371695A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1264US11557558B2Structure of semiconductor device and method for bonding two substratesUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·6 claims
- 1360US2023238647A1Multi-layered battery vent management systems for traction battery packsFORD GLOBAL TECH LLC·Filed 2022·Application pending·0 cites
- 1455US10333118B2Electronics umbrella for electrified vehicle battery packsFORD GLOBAL TECH LLC·Filed 2016·Granted Jun 25, 2019·0 cites·12 claims
- 1555US2025015023A1Semiconductor structure and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1653US11569188B2Semiconductor device including elongated bonding structure between the substrateUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 31, 2023·0 cites·18 claims
- 1752US2024315095A1Micro display deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →