Inventor · disambiguated record
Chi-Hai Kuo
Also filed as: KUO CHI-HAI
11 granted patents·5 pending applications·2 citations·filing 2020–2025
78Inventor score
Files withUNIMICRON TECHNOLOGY CORP16
Top patents by PatentIndex Score
16 records- 0184US11460255B2Vapor chamber device and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 4, 2022·2 cites·10 claims
- 0275US12250776B2Substrate structure and cutting method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Mar 11, 2025·0 cites·13 claims
- 0367US12185479B2Flexible circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·0 cites·17 claims
- 0464US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
- 0564US2025168988A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0664US2023067112A1Vapor chamber structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 0757US2021247147A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 0854US12062742B2Package structure and manufacturing method of the sameUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 13, 2024·0 cites·10 claims
- 0952US11764344B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 1050US11955587B2Light emitting diode package structure and manufacturing method thereof and manufacturing method of display deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 1149US11710690B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 1248US11682612B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jun 20, 2023·0 cites·8 claims
- 1348US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 1448US2022328387A1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 1546US11476234B2Chip package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 18, 2022·0 cites·12 claims
- 1644US2021251107A1Vapor chamber structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →