Inventor · disambiguated record
Chin-Chia Kuo
Also filed as: KUO CHIN-CHIA
17 granted patents·11 pending applications·42 citations·filing 2003–2025
89Inventor score
Top patents by PatentIndex Score
28 records- 0196US11075242B2Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·14 cites·20 claims
- 0293US10141398B1High voltage MOS structure and its manufacturing methodUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·13 cites·13 claims
- 0383US11545447B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·1 cites·7 claims
- 0481US2024371900A1Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0577US2024355764A1Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0677US2024379692A1Image sensor with diffusion barrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0775US2025280555A1Middle voltage transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0875US2025280554A1Middle voltage transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0973US12057412B2Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 1073US2024021644A1Trench isolation structure for image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1172US12136638B2Semiconductor devices for image sensingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 1271US2025248163A1Backside Diode DesignTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1370US12439709B2Image sensor with diffusion barrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1468US12336208B2Middle voltage transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·7 claims
- 1568US12278253B2Backside diode designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 15, 2025·0 cites·20 claims
- 1665US11862654B2Trench isolation structure for image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1765US6928748B2Method to improve post wafer etch cleaning processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 16, 2005·14 cites·21 claims
- 1861US11348881B2Device crack-stop structure to prevent damage due to dicing crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 1961US11114390B2Semiconductor device and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 7, 2021·0 cites·13 claims
- 2058US11569380B2Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 31, 2023·0 cites·12 claims
- 2157US12464762B2EDMOS and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 4, 2025·0 cites·16 claims
- 2255US12419075B2Transistor with embedded insulating structure setUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 16, 2025·0 cites·19 claims
- 2353US2025015161A1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2453US2025056868A1Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2550US2024222455A1High-voltage transistor, level-up shifting circuit, and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2647US2023335609A1Transistor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2742US10068793B1Semiconductor structure for preventing generation of void and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·0 cites·19 claims
- 2830US10468494B2High-voltage device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 5, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →