Inventor · disambiguated record
Ching C. Lee
Also filed as: LEE CHING C · LEE CHING-CHING
2 granted patents·1 pending application·75 citations·filing 1993–2006
68Inventor score
Top patents by PatentIndex Score
3 records- 0169US5567981ABonding pad structure having an interposed rigid layerINTEL CORP·Filed 1993·Granted Oct 22, 1996·40 cites·30 claims
- 0266US6265300B1Wire bonding surface and bonding methodINTEL CORP·Filed 1993·Granted Jul 24, 2001·35 cites·23 claims
- 0349US2008000796A1Shock-absorbing packaging deviceUNIVERSAL SCIENT IND CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →