Inventor · disambiguated record
Choon Kuan Lee
Also filed as: LEE CHOON KUAN
71 granted patents·5 pending applications·1,110 citations·filing 2002–2022
99Inventor score
Files withMICRON TECHNOLOGY INC50CORISIS DAVID J9LEE CHOON KUAN7CHONG CHIN HUI2LUA EDMUND KOON TIAN2
Top patents by PatentIndex Score
76 records- 0199US7692931B2Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 6, 2010·108 cites·38 claims
- 0298US8148807B2Packaged microelectronic devices and associated systemsLEE CHOON KUAN·Filed 2010·Granted Apr 3, 2012·69 cites·15 claims
- 0398US8106491B2Methods of forming stacked semiconductor devices with a leadframe and associated assembliesCORISIS DAVID J·Filed 2007·Granted Jan 31, 2012·66 cites·19 claims
- 0498US7671459B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesMICRON TECHNOLOGIES INC·Filed 2006·Granted Mar 2, 2010·161 cites·11 claims
- 0597US8450839B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesCORISIS DAVID J·Filed 2010·Granted May 28, 2013·36 cites·8 claims
- 0697US7745920B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 29, 2010·48 cites·16 claims
- 0797US7557443B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 7, 2009·66 cites·42 claims
- 0897US7425758B2Metal core foldover package structuresMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·61 cites·53 claims
- 0997US7083425B2Slanted vias for electrical circuits on circuit boards and other substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 1, 2006·89 cites·39 claims
- 1095US8093702B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesLUA EDMUND KOON TIAN·Filed 2007·Granted Jan 10, 2012·74 cites·18 claims
- 1195US7888185B2Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 15, 2011·43 cites·22 claims
- 1295US7485969B2Stacked microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·37 cites·41 claims
- 1393US8823159B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 2, 2014·12 cites·19 claims
- 1493US8115112B2Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substratesCORISIS DAVID J·Filed 2008·Granted Feb 14, 2012·22 cites·30 claims
- 1592US8940581B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesLEE CHOON KUAN·Filed 2011·Granted Jan 27, 2015·10 cites·13 claims
- 1691US8426743B2Electronic device assemblies including conductive vias having two or more conductive elementsCORISIS DAVID J·Filed 2010·Granted Apr 23, 2013·10 cites·17 claims
- 1790US9640458B2Stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 2, 2017·7 cites·14 claims
- 1888US8203213B2Methods for packaging microelectronic devices and microelectronic devices formed using such methodsLEE CHOON KUAN·Filed 2010·Granted Jun 19, 2012·8 cites·21 claims
- 1987US8138021B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsCORISIS DAVID J·Filed 2010·Granted Mar 20, 2012·9 cites·21 claims
- 2085US6921860B2Microelectronic component assemblies having exposed contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 26, 2005·39 cites·63 claims
- 2184US9147623B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 29, 2015·5 cites·18 claims
- 2284US8507318B2Method for manufacturing microelectronic devicesYE SENG KIM DALSON·Filed 2009·Granted Aug 13, 2013·9 cites·21 claims
- 2383US6787923B2Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masksMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 7, 2004·32 cites·29 claims
- 2482US8754537B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2011·Granted Jun 17, 2014·4 cites·4 claims
- 2582US7759785B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 20, 2010·10 cites·18 claims
- 2680US12315769B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2022·Granted May 27, 2025·0 cites·19 claims
- 2777US8322031B2Method of manufacturing an interposerCHONG CHIN HUI·Filed 2008·Granted Dec 4, 2012·7 cites·19 claims
- 2876US7435913B2Slanted vias for electrical circuits on circuit boards and other substratesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 14, 2008·6 cites·14 claims
- 2976US7368391B2Methods for designing carrier substrates with raised terminalsMICRON TECHNOLOGY INC·Filed 2005·Granted May 6, 2008·8 cites·39 claims
- 3074US10431513B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·1 cites·14 claims
- 3173US11367667B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 21, 2022·0 cites·17 claims
- 3273US10593607B2Build-up package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 17, 2020·1 cites·13 claims
- 3372US8445997B2Stacked packaged integrated circuit devicesCORISIS DAVID J·Filed 2012·Granted May 21, 2013·2 cites·10 claims
- 3472US7749808B2Stacked microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Jul 6, 2010·4 cites·21 claims
- 3571US7465607B2Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array packageMICRON TECHNOLOGY INC·Filed 2007·Granted Dec 16, 2008·4 cites·17 claims
- 3670US8501546B2Stacked microelectronic devices and methods for manufacturing stacked microelectronic devicesLUA EDMUND KOON TIAN·Filed 2012·Granted Aug 6, 2013·2 cites·16 claims
- 3770US7915077B2Methods of making metal core foldover package structuresMICRON TECHNOLOGY INC·Filed 2008·Granted Mar 29, 2011·3 cites·24 claims
- 3869US9355994B2Build-up package for integrated circuit devices, and methods of making sameNG HONG WAN·Filed 2014·Granted May 31, 2016·1 cites·24 claims
- 3969US7326591B2Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 5, 2008·3 cites·35 claims
- 4066US8288859B2Semiconductor device packages including a semiconductor device and a redistribution elementLEE CHOON KUAN·Filed 2011·Granted Oct 16, 2012·1 cites·20 claims
- 4166US8030751B2Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substratesMICRON TECHNOLOGY INC·Filed 2008·Granted Oct 4, 2011·2 cites·17 claims
- 4265US8357566B2Pre-encapsulated lead frames for microelectronic device packages, and associated methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 22, 2013·2 cites·35 claims
- 4365US7061124B2Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masksMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·10 cites·23 claims
- 4465US7018871B2Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methodsMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 28, 2006·10 cites·27 claims
- 4564US11239128B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 4664US8772947B2Methods for packaging microelectronic devices and microelectronic devices formed using such methodsLEE CHOON KUAN·Filed 2012·Granted Jul 8, 2014·1 cites·20 claims
- 4763US8796836B2Land grid array semiconductor device packagesLEE CHOON KUAN·Filed 2005·Granted Aug 5, 2014·2 cites·23 claims
- 4862US10211114B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 19, 2019·0 cites·16 claims
- 4962US8869387B2Methods for making microelectronic die systemsCHONG CHIN HUI·Filed 2010·Granted Oct 28, 2014·1 cites·25 claims
- 5060US7759221B2Methods for packaging microelectronic devices and microelectronic devices formed using such methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 20, 2010·1 cites·28 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →