Inventor · disambiguated record
Chien-Hsun Lee
Also filed as: LEE CHIEN-HSUN
143 granted patents·41 pending applications·2,651 citations·filing 1991–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD149TAIWAN SEMICONDUCTOR MFG12HOLTEK SEMICONDUCTOR INC3PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC3YU CHEN-HUA3
Top patents by PatentIndex Score
184 records- 0199US9768145B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·47 cites·20 claims
- 0299US9496189B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·1.8k cites·19 claims
- 0398US11244879B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 0498US9653442B2Integrated circuit package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·40 cites·20 claims
- 0597US11664566B2Semiconductor device and method, where a dielectric material directly contacts a high-k dielectric material and first and second transmission linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·2 cites·20 claims
- 0697US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0797US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0897US9343433B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·31 cites·20 claims
- 0997US9171790B2Package on package devices and methods of packaging semiconductor diesYU CHEN-HUA·Filed 2012·Granted Oct 27, 2015·40 cites·19 claims
- 1097US8642393B1Package on package devices and methods of forming sameYU CHEN-HUA·Filed 2012·Granted Feb 4, 2014·48 cites·19 claims
- 1196US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 1296US10804242B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 13, 2020·9 cites·20 claims
- 1396US9935090B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·18 cites·20 claims
- 1495US11258151B2Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 1595US10854552B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·9 cites·20 claims
- 1695US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 1793US12199080B2Electronics card including multi-chip moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·1 cites·20 claims
- 1893US11855057B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 1993US11658164B2Electronics card including multi-chip moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
- 2093US10461022B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·8 cites·20 claims
- 2193US10319607B2Package-on-package structure with organic interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 11, 2019·16 cites·20 claims
- 2293US9984999B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·6 cites·20 claims
- 2393US9653443B2Thermal performance structure for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·13 cites·19 claims
- 2493US8704354B2Package on package structures and methods for forming the sameCHENG JUNG WEI·Filed 2012·Granted Apr 22, 2014·14 cites·20 claims
- 2592US12199065B2Multi-die package structures including redistribution layersPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2020·Granted Jan 14, 2025·2 cites·19 claims
- 2692US11894341B2Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 2792US9786976B2Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·6 cites·20 claims
- 2891US12368112B2Electronic component and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 22, 2025·1 cites·20 claims
- 2991US10555424B1Circuit board, semiconductor device including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 4, 2020·4 cites·10 claims
- 3090US11069573B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 20, 2021·5 cites·20 claims
- 3190US9847320B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 19, 2017·7 cites·17 claims
- 3290US9337135B2Pop joint through interposerTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·10 cites·20 claims
- 3390US9006032B2Package on package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·9 cites·20 claims
- 3489US10665520B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·4 cites·20 claims
- 3589US10530030B2Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·3 cites·20 claims
- 3689US5197654ABonding method using solder composed of multiple alternating gold and tin layersKATZ AVISHAY·Filed 1991·Granted Mar 30, 1993·81 cites·14 claims
- 3788US12494455B2Multi-die package structures including an interconnected package component disposed in a substrate cavityPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 3888US11145639B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 3988US11088069B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 4088US10056267B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 21, 2018·7 cites·20 claims
- 4188US9870946B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 16, 2018·7 cites·20 claims
- 4288US5234149ADebondable metallic bonding methodAT & T BELL LAB·Filed 1992·Granted Aug 10, 1993·109 cites·20 claims
- 4388US2025126723A1Method for forming circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4488US2025311116A1Electronic assembly having circuit carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4587US12506115B2Multi-die package structures including redistribution layersPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Dec 23, 2025·0 cites·19 claims
- 4687US11728217B2Wafer level package structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 4787US10957672B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 23, 2021·3 cites·20 claims
- 4887US9437551B2Concentric bump design for the alignment in die stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·7 cites·20 claims
- 4986US12354924B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 5086US11217538B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·3 cites·20 claims
Showing the top 50 of 184 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →