Inventor · disambiguated record
Chiu-Wen Lee
Also filed as: LEE CHIU-WEN
8 granted patents·10 pending applications·36 citations·filing 2002–2024
83Inventor score
Top patents by PatentIndex Score
18 records- 0195US11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 21, 2021·8 cites·19 claims
- 0291US11594518B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 28, 2023·2 cites·17 claims
- 0381US9953930B1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 24, 2018·5 cites·18 claims
- 0478US9443813B1Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 13, 2016·3 cites·12 claims
- 0577US2025022848A1Semiconductor package including processing element and i/o elementADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0676US12107074B2Semiconductor package including processing element and I/O elementADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 1, 2024·0 cites·16 claims
- 0771US6788092B2Test assembly for integrated circuit packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Sep 7, 2004·18 cites·2 claims
- 0857US11967559B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 23, 2024·0 cites·7 claims
- 0949US2024329344A1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1049US2024332192A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1149US2024329300A1Package device and electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1249US2024345341A1Package deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1348US9960136B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 1, 2018·0 cites·13 claims
- 1448US2024345315A1Optoelectronic packageADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1546US2024250030A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1643US2021265273A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1740US2006283627A1Substrate structure of integrated embedded passive components and method for fabricating the sameADVANCED SEMINCONDUCTOR ENGINE·Filed 2005·Application pending·0 cites
- 1833US2004155241A1Test assembly for integrated circuit packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →