Inventor · disambiguated record
Chia-Ken Leong
Also filed as: LEONG CHIA-KEN
6 granted patents·3 pending applications·97 citations·filing 2007–2022
84Inventor score
Files withADVANCED MICRO DEVICES INC2TOSAYA ERIC2BHAGAVAT MILIND S1GLOBALFOUNDRIES INC1HENG STEPHEN1
Top patents by PatentIndex Score
9 records- 0197US10510721B2Molded chip combinationBHAGAVAT MILIND S·Filed 2017·Granted Dec 17, 2019·32 cites·20 claims
- 0287US8405187B2Chip package with channel stiffener frameTOSAYA ERIC·Filed 2011·Granted Mar 26, 2013·12 cites·20 claims
- 0387US8216887B2Semiconductor chip package with stiffener frame and configured lidHENG STEPHEN F·Filed 2009·Granted Jul 10, 2012·17 cites·21 claims
- 0483USD641720SCircuit package lidADVANCED MICRO DEVICES INC·Filed 2010·Granted Jul 19, 2011·29 cites·1 claims
- 0571US8008133B2Chip package with channel stiffener frameGLOBALFOUNDRIES INC·Filed 2008·Granted Aug 30, 2011·4 cites·21 claims
- 0653US2024203736A1Reusable templates for semiconductor design and fabricationADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0744US2013258619A1Stiffener frame with circuit board corner protectionLEY TOM J·Filed 2012·Application pending·0 cites
- 0839US2008284047A1Chip Package with Stiffener RingTOSAYA ERIC·Filed 2007·Application pending·0 cites
- 0937USD658607SCircuit package lidHENG STEPHEN·Filed 2011·Granted May 1, 2012·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →