Inventor · disambiguated record
Chin Kee Leow
Also filed as: LEOW CHIN KEE
1 granted patent·4 pending applications·0 citations·filing 2021–2025
14Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0166US12278171B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 0265US2025210478A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0357US2023197585A1Semiconductor package interconnect and power connection by metallized structures on package bodyINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0457US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0549US2025385220A1Method of forming an electrical connection and electrical connectionINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →