Inventor · disambiguated record
Chi Kuen Vincent Leung
Also filed as: LEUNG CHI KUEN · LEUNG CHI KUEN VINCENT
4 granted patents·3 pending applications·63 citations·filing 2007–2010
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US8194411B2Electronic package with stacked modules with channels passing through metal layers of the modulesLEUNG CHI KUEN VINCENT·Filed 2009·Granted Jun 5, 2012·43 cites·11 claims
- 0286US8030208B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Oct 4, 2011·16 cites·11 claims
- 0367US7832278B2Multi-chip packageHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Nov 16, 2010·4 cites·29 claims
- 0442US2009189269A1Electronic Circuit PackageLEUNG LAP-WAI LYDIA·Filed 2008·Application pending·0 cites
- 0542US2011147908A1Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package AssemblySUN PENG·Filed 2009·Application pending·0 cites
- 0642US2009115051A1Electronic Circuit PackageLEUNG LAP-WAI LYDIA·Filed 2007·Application pending·0 cites
- 0738US8544165B2Apparatus for aligning electronic componentsLEUNG CHI KUEN VINCENT·Filed 2010·Granted Oct 1, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →