Inventor · disambiguated record
Chih-Sheng Li
Also filed as: LI CHIH-SHENG
14 granted patents·5 pending applications·134 citations·filing 2003–2025
92Inventor score
Top patents by PatentIndex Score
19 records- 0197US9905467B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 27, 2018·19 cites·20 claims
- 0297US9722050B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 1, 2017·14 cites·20 claims
- 0392US10163717B2Method of forming FinFET device by adjusting etch selectivity of dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·5 cites·20 claims
- 0491US11670608B2Prevention of metal pad corrosion due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 0589US6765468B2Inductor module including plural inductor winding sections connected to a common contact and wound on a common inductor coreMICRO STAR INT CO LTD·Filed 2003·Granted Jul 20, 2004·42 cites·11 claims
- 0685US10998235B2FinFET with sloped surface at interface between isolation structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·1 cites·20 claims
- 0785US6885274B2Inductor module including inductor windings wound on a common inductor coreMICRO STAR INT CO LTD·Filed 2003·Granted Apr 26, 2005·37 cites·11 claims
- 0884US10468504B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·2 cites·20 claims
- 0983US10164072B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1082US12183697B2Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 1181US2025140722A1Semiconductor device having a metal pad and a protective layer for corrosion prevention due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1280US10727135B2FinFET with sloped surface at interface between isolation structures and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 28, 2020·1 cites·20 claims
- 1379US10964801B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·1 cites·20 claims
- 1479US10504787B2FinFET with sloped surface at interface between isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 1575US2025323214A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1670US2025087633A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1760US2025239490A1Die edge structure for molding compound filling and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1860US2025239548A1Bonded device structures with improved stress distribution and reduced cracking and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1952US6825643B2Power converter module with an electromagnetically coupled inductor for switch control of a rectifierMICRO STAR INT CO LTD·Filed 2003·Granted Nov 30, 2004·7 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →