Inventor · disambiguated record
Chih Yang Li
Also filed as: LI CHIH YANG
5 granted patents·6 pending applications·27 citations·filing 2003–2024
75Inventor score
Files withWESTERN DIGITAL TECH INC4RIGETTI & CO LLC2SANDISK TECHNOLOGIES INC2RIGETTI & CO INC1SANDISK TECHNOLOGIES LLC1
Top patents by PatentIndex Score
11 records- 0193US11121301B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO INC·Filed 2018·Granted Sep 14, 2021·21 cites·16 claims
- 0289US12207569B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2023·Granted Jan 21, 2025·1 cites·20 claims
- 0386US11011500B2Memory scaling semiconductor deviceSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0467US11770982B1Microwave integrated quantum circuits with cap wafers and their methods of manufactureRIGETTI & CO LLC·Filed 2021·Granted Sep 26, 2023·0 cites·12 claims
- 0563US2025254893A1Processing core including high capacity low latency storage memorySANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0659US2025293205A1Processing core including integrated high capacity high bandwidth storage memoryWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 0758US2025239510A1High capacity high bandwidth non-volatile memory deviceSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0855US2025006701A1Semiconductor die stacking architecture and connection method thereforeWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0952US2024312916A1Semiconductor Device Package with Die Stackup and InterposerWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1051US2023395438A1Semiconductor device including select dies of known thicknessesWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 1147US6759341B1Wafering method comprising a plasma etch with a gas emitting wafer holderTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jul 6, 2004·3 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →