Inventor · disambiguated record
Chih-Yueh Li
Also filed as: LI CHIH-YUEH
21 granted patents·8 pending applications·47 citations·filing 2006–2024
92Inventor score
Top patents by PatentIndex Score
29 records- 0189US10373861B1FinFET with curved STIUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 6, 2019·7 cites·11 claims
- 0285US10916694B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 9, 2021·2 cites·5 claims
- 0385US8710632B2Compound semiconductor epitaxial structure and method for fabricating the sameYU TIEN-WEI·Filed 2012·Granted Apr 29, 2014·13 cites·16 claims
- 0483US12471498B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Nov 11, 2025·0 cites·5 claims
- 0583US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0681US7510974B2CMP processUNITED MICROELECTRONICS CORP·Filed 2006·Granted Mar 31, 2009·17 cites·42 claims
- 0780US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 0879US8883033B2Method for removing nitride materialUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 11, 2014·5 cites·15 claims
- 0977US11778922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 3, 2023·0 cites·13 claims
- 1075US11737370B2Magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 1175US11706993B2Method of manufacturing magnetoresistive random access memory (MRAM) deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 18, 2023·0 cites·6 claims
- 1275US10276443B2Insulating layer next to fin structure and method of removing fin structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 30, 2019·2 cites·7 claims
- 1370US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
- 1470US10622245B2FinFET with curved STIUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 14, 2020·1 cites·7 claims
- 1566US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 1653US2025169368A1Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1746US2025053721A1Method to derive the location and size of oxide spacing areaUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1845US9305847B2Method of manufacturing semiconductor device having gate metalUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 5, 2016·0 cites·10 claims
- 1944US9748333B2Semiconductor structure including dummy structure and semiconductor pattern structure including dummy structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 29, 2017·0 cites·18 claims
- 2043US11461693B2Training apparatus and training method for providing sample size expanding modelUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 4, 2022·0 cites·20 claims
- 2142US9245972B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jan 26, 2016·0 cites·19 claims
- 2240US9613796B2Method of flattening a waferUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 4, 2017·0 cites·14 claims
- 2340US9136105B2Bevel etcherYU TAI-HENG·Filed 2008·Granted Sep 15, 2015·0 cites·13 claims
- 2439US2008261402A1Method of removing insulating layer on substrateUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2539US2008125018A1Solution for fixed abrasive chemical mechanical polishing process and fixed abrasive chemical mechanical polishing methodUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2639US2008070485A1Chemical mechanical polishing processUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2738US9548268B2Semiconductor device having bilayer metal layerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·0 cites·7 claims
- 2836US2020185597A1Memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2935US2011189855A1METHOD FOR CLEANING SURFACE CONTAINING CuLIN JEN-CHIEH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →