Inventor · disambiguated record
Cheng-Jia Li
Also filed as: LI CHENG · LI CHENG-JIA
12 granted patents·6 pending applications·3 citations·filing 2016–2024
81Inventor score
Files withHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD13AVARY HOLDING SHENZHEN CO LTD2SHANGHAI NUCLEAR ENG RES & DESIGN INST CO LTD2SHANDONG IRON & STEEL CO LTD1
Top patents by PatentIndex Score
18 records- 0175US11234331B2Multilayer printed circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·4 claims
- 0273US2024196541A1Transparent circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 0370US9832888B1Circuit board and method for making the sameAVARY HOLDING (SHENZHEN) CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·7 claims
- 0460US11140785B2Flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 0558US12016119B2Method for manufacturing multilayer printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·9 claims
- 0658US11950371B2Method for manufacturing transparent circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·5 claims
- 0756US10638606B2Composite circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·6 claims
- 0855US10542627B2Method for manufacturing a flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 0954US2025374432A1Flexible circuit board and method of manufacturing thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 1052US10159149B2Composite circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·9 claims
- 1150US2025056721A1Circuit board and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Application pending·0 cites
- 1246US12310144B2Method of manufacturing display module with light emitting diode free of a split-screen boundary line and display module with light emitting diodeHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted May 20, 2025·0 cites·18 claims
- 1345US12447516B2Single-tooth track plate cogging-down pass and hot rolling methodSHANDONG IRON & STEEL CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·7 claims
- 1443US9860977B1Transparent flexible printed circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2017·Granted Jan 2, 2018·0 cites·11 claims
- 1540US11582885B2Circuit board and method for manufacturing circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·10 claims
- 1640US2024229463A1Cast-in-place composite shielding shell with ultra-high performance concrete (uhpc)SHANGHAI NUCLEAR ENG RES & DESIGN INST CO LTD·Filed 2021·Application pending·0 cites
- 1738US2024218656A1Semi-fabricated composite shielding shell with ultra-high performance concrete (uhpc)SHANGHAI NUCLEAR ENG RES & DESIGN INST CO LTD·Filed 2021·Application pending·0 cites
- 1838US2022418101A1Multi-layer circuit board with embedded components and method for manufacturing sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →