Inventor · disambiguated record

Chin-Wei Liang

Also filed as: LIANG CHIN-WEI · LIANG CHIN-WEI KATE

44 granted patents·7 pending applications·295 citations·filing 1999–2025

97Inventor score

Technology areasH10W H01L H10P H04L H10K

Files withTAIWAN SEMICONDUCTOR MFG CO LTD41 ADVANCED MICRO DEVICES INC6 GLOBALFOUNDRIES INC1 TAIWAN SEMICONDUCTOR MFG1 TAIWAN TEXTILE RES INST1

Top patents by PatentIndex Score

51 records

0195US6701406B1PCI and MII compatible home phoneline networking alliance (HPNA) interface deviceADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 2, 2004·119 cites·5 claims
0294US11887929B2Techniques to inhibit delamination from flowable gap-fill dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
0394US9647207B2Resistive random access memory (RRAM) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 9, 2017·11 cites·20 claims
0492US10818857B2Organic photosensitive device with an electron-blocking and hole-transport layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 27, 2020·4 cites·20 claims
0591US11495532B2Techniques to inhibit delamination from flowable gap-fill dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
0691US10193065B2High K scheme to improve retention performance of resistive random access memory (RRAM)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 29, 2019·9 cites·20 claims
0791US2025357123A1Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0888US11049767B2Semiconductor device and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·4 cites·20 claims
0988US9876184B2Organic photosensitive device with an electron-blocking and hole-transport layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 23, 2018·5 cites·20 claims
1088US9484537B2Organic photo diode with dual electron blocking layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 1, 2016·6 cites·19 claims
1187US10622555B2Film scheme to improve peeling in chalcogenide based PCRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·6 cites·20 claims
1286US12302663B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
1386US10510587B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
1486US9960353B2Method of fabricating an organic photodiode with dual electron blocking layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·4 cites·18 claims
1585US10350726B2Chemical mechanical polishing system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·3 cites·20 claims
1685US9219240B1Protective layer(s) in organic image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 22, 2015·4 cites·20 claims
1783US12266604B2Techniques to inhibit delamination from flowable gap-fill dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 1, 2025·0 cites·20 claims
1883US9425240B2Image sensors with organic photodiodes and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·3 cites·19 claims
1983US8351445B1Network interface systems and methods for offloading segmentation and/or checksumming with security processingGLOBALFOUNDRIES INC·Filed 2004·Granted Jan 8, 2013·31 cites·60 claims
2083US2025366252A1Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2182US12113090B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
2282US10748967B2Image sensors with organic photodiodes and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·1 cites·20 claims
2379US12444607B2Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
2479US7787481B1Prefetch scheme to minimize interpacket gapADVANCED MICRO DEVICES INC·Filed 2004·Granted Aug 31, 2010·16 cites·11 claims
2578US2024404877A1Methods of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2678US2025246538A1Techniques to inhibit delamination from flowable gap-fill dielectricTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2776US10967479B2Chemical mechanical polishing system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·1 cites·20 claims
2875US6947438B1PCI and MII compatible home phoneline networking alliance (HPNA) interface deviceADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 20, 2005·21 cites·2 claims
2973US11404484B2Image sensors with organic photodiodes and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
3071US11869916B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 9, 2024·0 cites·20 claims
3171US11348790B2Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·0 cites·20 claims
3271US9169117B1MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 27, 2015·1 cites·20 claims
3371US8504728B1Network interface with secondary data and packet information storage and memory control systems to accommodate out-of-order data processing and split transactions on a host system busWILLIAMS ROBERT ALAN·Filed 2004·Granted Aug 6, 2013·18 cites·10 claims
3469US12456649B2Semiconductor device and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 28, 2025·0 cites·20 claims
3566US9567206B2Structures and formation methods of micro-electro mechanical system deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·1 cites·20 claims
3664US10910260B2Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
3763US11024800B2Film scheme to improve peeling in chalcogenide based PCRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 1, 2021·0 cites·20 claims
3863US6912199B1Method to select transmission rate for network deviceADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 28, 2005·9 cites·13 claims
3957US10008546B2Image sensors with organic photodiodes and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 26, 2018·0 cites·20 claims
4055US10636661B2Apparatus and method for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 28, 2020·0 cites·20 claims
4155US10155214B2Getter, MEMS device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 18, 2018·0 cites·20 claims
4255US6853645B1PCI and MII compatible home phoneline networking alliance (HPNA) interface deviceADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 8, 2005·3 cites·11 claims
4353US2024113032A1Packaged interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4451US9543362B2Protective layer(s) in organic image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
4550US9637375B2MEMS device having a getter structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 2, 2017·0 cites·17 claims
4649US10115896B1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·0 cites·19 claims
4749US9725301B2Structures and formation methods of micro-electro mechanical system deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 8, 2017·0 cites·20 claims
4845US2010163103A1Organic Thin-Film Solar Cell Using Fullerene Derivative for Electron Acceptor and Method of Manufacturing the SameTAIWAN TEXTILE RES INST·Filed 2009·Application pending·0 cites
4941US11133231B2CMP apparatus and method for estimating film thicknessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 28, 2021·0 cites·20 claims
5035US2017207191A1Bonding system and associated apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Application pending·0 cites

Showing the top 50 of 51 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →