Inventor · disambiguated record
Chun-Lin Liao
Also filed as: LIAO CHUN-LIN
22 granted patents·5 pending applications·45 citations·filing 2005–2022
92Inventor score
Files withDELL PRODUCTS LP13TATUNG CO6TATUNG CO LTD2TOSHIBA GLOBAL COMMERCE SOLUTIONS HOLDINGS CORP2UNIMICRON TECHNOLOGY CORP2
Top patents by PatentIndex Score
27 records- 0191US10306749B1System and method of utilizing serpentine regionsDELL PRODUCTS LP·Filed 2018·Granted May 28, 2019·5 cites·7 claims
- 0287US10485096B2Differential trace pair systemDELL PRODUCTS LP·Filed 2017·Granted Nov 19, 2019·4 cites·7 claims
- 0384US7501583B2Low noise multilayer printed circuit boardTATUNG CO·Filed 2006·Granted Mar 10, 2009·13 cites·8 claims
- 0479US8720778B2System, method, and storage unit for managing multiple objects in an object zoneTOSHIBA GLOBAL COMMERCE SOLUTIONS HOLDINGS CORP·Filed 2013·Granted May 13, 2014·3 cites·12 claims
- 0577US10054979B1Placement of ground vias for high-speed differential signalsDELL PRODUCTS LP·Filed 2017·Granted Aug 21, 2018·3 cites·17 claims
- 0674US10595396B2System and method of utilizing serpentine regionsDELL PRODUCTS LP·Filed 2019·Granted Mar 17, 2020·1 cites·1 claims
- 0773US9038905B2System, method, and storage unit for managing multiple objects in an object zoneTOSHIBA GLOBAL COMMERCE SOLUTIONS HOLDINGS CORP·Filed 2014·Granted May 26, 2015·1 cites·15 claims
- 0872US7391281B2Method for suppressing resonant effect between capacitors connected in parallelTATUNG CO·Filed 2006·Granted Jun 24, 2008·5 cites·4 claims
- 0972US7183492B2Multi-layer printed circuit with low noiseTATUNG CO LTD·Filed 2005·Granted Feb 27, 2007·5 cites·5 claims
- 1069US10806024B2Method of utilizing serpentine regionsDELL PRODUCTS LP·Filed 2020·Granted Oct 13, 2020·0 cites·6 claims
- 1167US7259334B2Multi-layer printed circuit with low noiseTATUNG CO LTD·Filed 2005·Granted Aug 21, 2007·3 cites·5 claims
- 1264US12123907B2Detecting a via stripping issue in a printed circuit boardDELL PRODUCTS LP·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1363US10897813B2Differential trace pair systemDELL PRODUCTS LP·Filed 2019·Granted Jan 19, 2021·0 cites·4 claims
- 1461US8035993B2Circuit boardTATUNG CO·Filed 2009·Granted Oct 11, 2011·2 cites·13 claims
- 1557US11997785B2Circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 28, 2024·0 cites·10 claims
- 1652US10492290B2Circuit board pad mounting orientation systemDELL PRODUCTS LP·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 1751US10881006B2Package carrier and package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 29, 2020·0 cites·14 claims
- 1850US2010126759A1Structure of multi-layer printed circuit boardTATUNG CO·Filed 2009·Application pending·0 cites
- 1949US8093504B2Circuit board structure employing ferrite elementCHAO SHIH-CHIEH·Filed 2009·Granted Jan 10, 2012·0 cites·10 claims
- 2048US10856414B2System and method for minimizing connector pad open-circuit stubsDELL PRODUCTS LP·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 2147US2009056984A1Signal transmission structure and layout method for the sameTATUNG CO·Filed 2007·Application pending·0 cites
- 2246US10779404B2Circuit board pad resonance control systemDELL PRODUCTS LP·Filed 2018·Granted Sep 15, 2020·0 cites·15 claims
- 2344US2015067976A1Panel cleaning roller assemblyTA CHOU RUBBER IND CO LTD·Filed 2013·Application pending·0 cites
- 2442US11026321B2Information handling system comprising a processor coupled to a board and including a differential trace pair having a first straight differential trace and a second serpentine shape differential traceDELL PRODUCTS LP·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 2539US10813211B2Printed circuit board layout for mitigating near-end crosstalkDELL PRODUCTS LP·Filed 2018·Granted Oct 20, 2020·0 cites·17 claims
- 2637US2011208461A1Measurement correcting system and method thereofTATUNG CO·Filed 2010·Application pending·0 cites
- 2733US2018132344A1System and Method of Crosstalk Mitigation in Microstrip Serial Links in a Printed Circuit BoardDELL PRODUCTS LP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →