Inventor · disambiguated record
Cheng-Kuo Lin
Also filed as: LIN CHENG-KUO
21 granted patents·8 pending applications·50 citations·filing 2006–2025
92Inventor score
Top patents by PatentIndex Score
29 records- 0186US9356127B2Layout structure of heterojunction bipolar transistorsWIN SEMICONDUCTORS CORP·Filed 2013·Granted May 31, 2016·10 cites·19 claims
- 0283US9998087B2Acoustic wave device structure, integrated structure of power amplifier and acoustic wave deviceWIN SEMICONDUCTORS CORP·Filed 2017·Granted Jun 12, 2018·4 cites·35 claims
- 0383US7679870B2On-chip ESD protection circuit using enhancement-mode HEMT/MESFET technologyWIN SEMICONDUCTORS CORP·Filed 2006·Granted Mar 16, 2010·15 cites·14 claims
- 0481US9673186B2Semiconductor integrated circuitWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jun 6, 2017·4 cites·25 claims
- 0579US9653516B2Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereofWIN SEMICONDUCTORS CORP·Filed 2014·Granted May 16, 2017·5 cites·34 claims
- 0678US9087923B2Monolithic compound semiconductor structureWIN SEMICONDUCTORS CORP·Filed 2012·Granted Jul 21, 2015·6 cites·10 claims
- 0770US9019028B2Integrated epitaxial structure for compound semiconductor devicesWIN SEMICONDUCTORS CORP·Filed 2012·Granted Apr 28, 2015·3 cites·9 claims
- 0866US9911837B2Heterojunction bipolar transistorWIN SEMICONDUCTOR CORP·Filed 2016·Granted Mar 6, 2018·1 cites·6 claims
- 0962US12237382B2Semiconductor device and power amplifierWIN SEMICONDUCTORS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1062US2023371732A1Filtration container assembly and extraction assembly for sameGRAYL INC·Filed 2023·Application pending·0 cites
- 1161US2025169146A1Semiconductor device and power amplifierWIN SEMICONDUCTORS CORP·Filed 2025·Application pending·0 cites
- 1258US10103624B2Thermal sensor circuitWIN SEMICONDUCTORS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·10 claims
- 1354US10553709B2Heterojunction bipolar transistorWIN SEMICONDUCTOR CORP·Filed 2018·Granted Feb 4, 2020·0 cites·4 claims
- 1453US10756625B2Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereofWIN SEMICONDUCTORS CORP·Filed 2017·Granted Aug 25, 2020·0 cites·64 claims
- 1553US10727741B2Thermal sensing acoustic wave resonator and acoustic wave filter having thermal sensing acoustic wave resonatorWIN SEMICONDUCTORS CORP·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 1648US7420417B2Two-port dual-gate HEMT for discrete device applicationWIN SEMICONDUCTORS CORP·Filed 2006·Granted Sep 2, 2008·2 cites·4 claims
- 1746US2016020307A1Heterojunction Bipolar TransistorWIN SEMICONDUCTORS CORP·Filed 2015·Application pending·0 cites
- 1843US2016247797A1Layout structure of heterojunction bipolar transistorsWIN SEMICONDUCTORS CORP·Filed 2016·Application pending·0 cites
- 1942US10498310B2Protective cover for an acoustic wave device and fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2016·Granted Dec 3, 2019·0 cites·10 claims
- 2039US10298203B2Protection structure for semiconductor device packageWIN SEMICONDUCTORS CORP·Filed 2017·Granted May 21, 2019·0 cites·22 claims
- 2139US2014231876A1pHEMT and HBT integrated epitaxial structureWIN SEMICONDUCTORS CORP·Filed 2014·Application pending·0 cites
- 2239US2014209926A1Semiconductor integrated circuitWIN SEMICONDUCTORS CORP·Filed 2013·Application pending·0 cites
- 2337US9905610B2Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereofWIN SEMICONDUCTORS CORP·Filed 2017·Granted Feb 27, 2018·0 cites·78 claims
- 2436US10096583B2Method for fabricating a semiconductor integrated chipWIN SEMICONDUCTORS CORP·Filed 2016·Granted Oct 9, 2018·0 cites·5 claims
- 2536US2013320402A1pHEMT HBT INTEGRATED EPITAXIAL STRUCTURE AND A FABRICATION METHOD THEREOFWIN SEMICONDUCTORS CORP·Filed 2012·Application pending·0 cites
- 2635US10453805B2Protection structure for semiconductor device packageWIN SEMICONDUCTORS CORP·Filed 2016·Granted Oct 22, 2019·0 cites·13 claims
- 2734US9991198B2Layout method for compound semiconductor integrated circuitsWIN SEMICONDUCTORS CORP·Filed 2016·Granted Jun 5, 2018·0 cites·30 claims
- 2834US2017272052A1Protective Cover for an Acoustic Wave Device and Fabrication Method ThereofWIN SEMICONDUCTORS CORP·Filed 2017·Application pending·0 cites
- 2927US7842591B2Method of fabricating short-gate-length electrodes for integrated III-V compound semiconductor devicesWIN SEMICONDUCTORS CORP·Filed 2008·Granted Nov 30, 2010·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →