Inventor · disambiguated record
Chun-Cheng Lin
Also filed as: LIN CHUN-CHENG
84 granted patents·21 pending applications·393 citations·filing 1996–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG12LIN CHUN CHENG11CHEN MENG-TSE8DELL PRODUCTS LP8
Top patents by PatentIndex Score
105 records- 0198US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
- 0297US12057359B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0397US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0497US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 0595US10636715B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 0695US9799631B2Semiconductor packaging structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 24, 2017·8 cites·20 claims
- 0794US7323176B2Immuno-modulating antitumor activities of ganoderma lucidum (reishi) polysaccharidesACADEMIA SINICA·Filed 2006·Granted Jan 29, 2008·13 cites·6 claims
- 0893US8901726B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 2, 2014·14 cites·20 claims
- 0992US7135183B1Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharidesACADEMIA SINICA·Filed 2002·Granted Nov 14, 2006·30 cites·4 claims
- 1091US11163343B1Flexible power supply unit (PSU) bayDELL PRODUCTS LP·Filed 2020·Granted Nov 2, 2021·5 cites·18 claims
- 1191US10879192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·13 claims
- 1290US11456226B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·20 claims
- 1390US6807833B1Unlocking device for a lever handle door lockTAIWAN FU HSING IND CO LTD·Filed 2003·Granted Oct 26, 2004·53 cites·7 claims
- 1488US9412689B2Semiconductor packaging structure and methodLIN CHUN-CHENG·Filed 2012·Granted Aug 9, 2016·6 cites·20 claims
- 1587US9269687B2Packaging methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·7 cites·18 claims
- 1685US7560114B2Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharidesWANG YUAN-YUAN·Filed 2007·Granted Jul 14, 2009·5 cites·7 claims
- 1784US9230935B2Package on package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·5 cites·20 claims
- 1883US12278208B2Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1983US9312214B2Semiconductor packages having polymer-containing substrates and methods of forming sameCHEN MENG-TSE·Filed 2011·Granted Apr 12, 2016·7 cites·20 claims
- 2083US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
- 2183US2024355691A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2282US9412717B2Apparatus and methods for molded underfills in flip chip packagingCHEN MENG-TSE·Filed 2011·Granted Aug 9, 2016·6 cites·20 claims
- 2381US9978716B2Package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·3 cites·20 claims
- 2481US9778683B2Locking mechanisms to lock key movement of keyboardsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Oct 3, 2017·6 cites·14 claims
- 2581US9627369B2Packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·3 cites·20 claims
- 2681US9082636B2Packaging methods and structures for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 14, 2015·4 cites·20 claims
- 2781US8674496B2System and method for fine pitch PoP structureLIN CHENG-CHUNG·Filed 2012·Granted Mar 18, 2014·5 cites·20 claims
- 2881US2025219010A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2980US8664040B2Exposing connectors in packages through selective treatmentYU CHEN-HUA·Filed 2011·Granted Mar 4, 2014·4 cites·14 claims
- 3079US9786622B2Semiconductor packageCHENG MING-DA·Filed 2011·Granted Oct 10, 2017·5 cites·20 claims
- 3179US8609462B2Methods for forming 3DIC packageCHEN MENG-TSE·Filed 2011·Granted Dec 17, 2013·4 cites·20 claims
- 3279US8520793B2Phase detector, phase detecting method, and clock-and-data recovery deviceLIN CHUN-CHENG·Filed 2011·Granted Aug 27, 2013·6 cites·26 claims
- 3377US10721835B2Information handling system with an adjustable guide for peripheral cardsDELL PRODUCTS LP·Filed 2017·Granted Jul 21, 2020·3 cites·20 claims
- 3477US9455725B2Phase detector and associated phase detecting methodM31 TECH CORP·Filed 2015·Granted Sep 27, 2016·4 cites·14 claims
- 3577US8354234B2Mass spectrometric analysis of ligand conjugated magnetic nanoparticlesACADEMIA SINICA·Filed 2006·Granted Jan 15, 2013·8 cites·15 claims
- 3677US8265317B2Electronic deviceTSENG CHEN·Filed 2010·Granted Sep 11, 2012·6 cites·10 claims
- 3777US5830871AInhibitors of E-, P- and L-selectin bindingSCRIPPS RESEARCH INST·Filed 1996·Granted Nov 3, 1998·51 cites·42 claims
- 3876US7500759B2Retractable lighting device for barbecue stoveLIN CHUN-CHENG·Filed 2006·Granted Mar 10, 2009·12 cites·18 claims
- 3975US9030022B2Packages and methods for forming the sameCHEN MENG-TSE·Filed 2011·Granted May 12, 2015·3 cites·20 claims
- 4075US8153387B2Method for immobilizing glycoproteinLIN CHUN-CHENG·Filed 2009·Granted Apr 10, 2012·2 cites·22 claims
- 4174US10522452B2Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substratesHUANG KUEI WEI·Filed 2011·Granted Dec 31, 2019·4 cites·22 claims
- 4274US9892962B2Wafer level chip scale package interconnects and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·2 cites·20 claims
- 4373US10832999B2Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substratesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 4473US10172252B1Information handling system having an ergonomic plunger for a server planar boardDELL PRODUCTS LP·Filed 2017·Granted Jan 1, 2019·2 cites·17 claims
- 4573US8755180B2Foldable electric deviceYEH SHU-HUA·Filed 2012·Granted Jun 17, 2014·7 cites·10 claims
- 4671US8365716B2Barbecue grill assemblyLIN CHUN-CHENG·Filed 2010·Granted Feb 5, 2013·3 cites·5 claims
- 4770US12467463B2Power supply unit with consolidated different airflow direction fansDELL PRODUCTS LP·Filed 2024·Granted Nov 11, 2025·0 cites·17 claims
- 4869US9142523B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·2 cites·20 claims
- 4968US9589861B2Semiconductor packaging having warpage control and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·1 cites·20 claims
- 5068US8383767B2Immunogenic protein carrier containing an antigen presenting cell binding domain and a cysteine-rich domainACADEMIA SINICA·Filed 2009·Granted Feb 26, 2013·1 cites·23 claims
Showing the top 50 of 105 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →