Inventor · disambiguated record
Chun-Hao Lin
Also filed as: LIN CHUN-HAO
44 granted patents·25 pending applications·93 citations·filing 2008–2025
97Inventor score
Files withUNITED MICROELECTRONICS CORP32REALTEK SEMICONDUCTOR CORP15TAIWAN SEMICONDUCTOR MFG CO LTD12HTC CORP3LIN CHUN HAO2
Top patents by PatentIndex Score
69 records- 0197US11581422B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 14, 2023·3 cites·1 claims
- 0297US11527638B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·3 cites·9 claims
- 0397US9953880B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 24, 2018·20 cites·12 claims
- 0495US10943993B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·7 cites·9 claims
- 0594US9972623B1Semiconductor device including barrier layer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 15, 2018·10 cites·3 claims
- 0689US10153210B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·5 cites·12 claims
- 0789US10141228B1FinFET device having single diffusion break structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 27, 2018·4 cites·6 claims
- 0889US9627268B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 18, 2017·5 cites·5 claims
- 0989US2024413225A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1089US2025015165A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1187US12237329B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 25, 2025·0 cites·19 claims
- 1283US12100750B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 24, 2024·0 cites·6 claims
- 1383US8312477B2Mobile device with multiple operating systems and method for sharing a wireless communication module between operating systems thereofLIN CHUN-HAO·Filed 2008·Granted Nov 13, 2012·11 cites·16 claims
- 1482US12125900B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Oct 22, 2024·0 cites·7 claims
- 1581US10340272B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·2 cites·15 claims
- 1680US9954982B2Transmission apparatus and transmission method thereofREALTEK SEMICONDUCTOR CORP·Filed 2016·Granted Apr 24, 2018·5 cites·15 claims
- 1779US10290324B2Recording device, recording control method and non-transitory computer readable medium thereofHTC CORP·Filed 2015·Granted May 14, 2019·4 cites·16 claims
- 1878US12469752B2Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1978US10483395B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Nov 19, 2019·2 cites·10 claims
- 2078US2025169169A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2178US2024395638A1Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2277US11876095B2Method for enlarging tip portion of a fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 2376US10656676B2Docking device, electrical device, and MAC address cloning methodREALTEK SEMICONDUCTOR CORP·Filed 2018·Granted May 19, 2020·2 cites·16 claims
- 2474US2023378214A1Pixel array including air gap reflection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2572US10446448B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·1 cites·5 claims
- 2671USD1008479SMassagerLIN CHUN HAO·Filed 2021·Granted Dec 19, 2023·4 cites·1 claims
- 2770US12033902B2Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 2870US10122691B2Receiving apparatus and packet processing method thereofREALTEK SEMICONDUCTOR CORP·Filed 2016·Granted Nov 6, 2018·2 cites·19 claims
- 2969US11088137B2Method for enlarging tip portion of a fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 10, 2021·0 cites·10 claims
- 3067US10252157B2Control circuit of client-side game console for enabling multiple video game consoles to together emulate same standalone multiplayer video game through networking connectionREALTEK SEMICONDUCTOR CORP·Filed 2017·Granted Apr 9, 2019·2 cites·8 claims
- 3163US2025300091A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3263US2025391788A1Semiconductor chip including a capacitive seal ring architecture, and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3361US12249649B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 11, 2025·0 cites·18 claims
- 3461US10566327B2Method for enlarging tip portion of a fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 18, 2020·0 cites·4 claims
- 3561US2025275271A1Pixel sensor arrays and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3661US2025267961A1Pixel sensor arrays and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3759US12147368B2Method of transmitting universal serial bus (USB) commands and associated electronic deviceREALTEK SEMICONDUCTOR CORP·Filed 2022·Granted Nov 19, 2024·0 cites·18 claims
- 3859US10694959B2Image based blood pressure monitoring methodUNIV NATIONAL CHIAO TUNG·Filed 2018·Granted Jun 30, 2020·0 cites·10 claims
- 3959US10692780B2Method for protecting epitaxial layer by forming a buffer layer on NMOS regionUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 23, 2020·0 cites·9 claims
- 4059US2024395847A1Optoelectronic device having a photodiode including a quantum dot materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4159US2025089349A1Structure with capacitor and fin transistor and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 4259US2025293085A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4359US2025391766A1Ultra-thick metal routing structure and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4458US11212093B2Method of social key recovery and related deviceHTC CORP·Filed 2019·Granted Dec 28, 2021·1 cites·21 claims
- 4557US2025233063A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4657US2025325998A1Spraying device, spraying system and operating method thereof for semiconductor substrateGRAND PROCESS TECH CORPORATION·Filed 2024·Application pending·0 cites
- 4757US2024387600A1Optoelectronic device including near infrared photodiodes and near infrared light emitting diodesTAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD·Filed 2023·Application pending·0 cites
- 4856US11703910B2Docking station, electrical device, and method for configuring basic input output systemREALTEK SEMICONDUCTOR CORP·Filed 2018·Granted Jul 18, 2023·0 cites·20 claims
- 4956US10256160B1Method for protecting epitaxial layer by forming a buffer layer on NMOS regionUNITED MICROELECTRONICS CORP·Filed 2017·Granted Apr 9, 2019·0 cites·7 claims
- 5055US2024105809A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →