Inventor · disambiguated record
Chun-Hung Lin
Also filed as: LIN CHUN W · LIN CHUN-HUNG
215 granted patents·122 pending applications·2,718 citations·filing 1992–2024
99Inventor score
Files withTAIWAN MICROLOOPS CORP59TAIWAN TEXTILE RES INST27ADVANCED SEMICONDUCTOR ENG22EMEMORY TECHNOLOGY INC22LIN CHUN-HUNG20
Top patents by PatentIndex Score
337 records- 0198US10048015B1Liquid-vapor separating type heat conductive structureTAIWAN MICROLOOPS CORP·Filed 2017·Granted Aug 14, 2018·15 cites·7 claims
- 0298US6238952B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted May 29, 2001·258 cites·8 claims
- 0397US11304331B1Heat dissipating module having auxiliary fanTAIWAN MICROLOOPS CORP·Filed 2020·Granted Apr 12, 2022·6 cites·6 claims
- 0497US11060799B1Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2020·Granted Jul 13, 2021·5 cites·6 claims
- 0596US6333562B1Multichip module having stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Dec 25, 2001·137 cites·15 claims
- 0696US6252305B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 26, 2001·137 cites·2 claims
- 0795US6700188B2Low-pin-count chip package having concave die pad and/or connections padsADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 2, 2004·88 cites·7 claims
- 0894US7323176B2Immuno-modulating antitumor activities of ganoderma lucidum (reishi) polysaccharidesACADEMIA SINICA·Filed 2006·Granted Jan 29, 2008·13 cites·6 claims
- 0994US6413801B1Method of molding semiconductor device and molding die for use thereinADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 2, 2002·58 cites·2 claims
- 1094US6359340B1Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 19, 2002·109 cites·15 claims
- 1193US12374316B2Separate active noise cancellation deviceTAIWAN MICROLOOPS CORP·Filed 2023·Granted Jul 29, 2025·2 cites·8 claims
- 1293US11486088B2Anti-staining resin, anti-staining fabric and fabricating method thereofTAIWAN TEXTILE RES INST·Filed 2021·Granted Nov 1, 2022·4 cites·11 claims
- 1393US10260781B2Liquid cooling device having diversion mechanismCOOLER MASTER TECH INC·Filed 2014·Granted Apr 16, 2019·10 cites·11 claims
- 1493US10018427B2Vapor chamber structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 10, 2018·9 cites·10 claims
- 1593US6461897B2Multichip module having a stacked chip arrangementADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 8, 2002·75 cites·3 claims
- 1693US5956473AMethod and system for managing a flash memory mass storage systemMACRONIX INT CO LTD·Filed 1996·Granted Sep 21, 1999·304 cites·13 claims
- 1792US9677820B2Electronic device and liquid cooling heat dissipation structure thereofCOOLER MASTER CO LTD·Filed 2015·Granted Jun 13, 2017·10 cites·16 claims
- 1892US9570381B2Semiconductor packages and related manufacturing methodsADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Feb 14, 2017·11 cites·18 claims
- 1992US9553065B2Bumps for chip scale packaging including under bump metal structures with different diametersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 24, 2017·12 cites·18 claims
- 2092US8199314B2System and method for improving immersion scanner overlay performancePENG JUI-CHUNG·Filed 2011·Granted Jun 12, 2012·12 cites·20 claims
- 2192US7135183B1Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharidesACADEMIA SINICA·Filed 2002·Granted Nov 14, 2006·30 cites·4 claims
- 2292US5745418AFlash memory mass storage systemMACRONIX INT CO LTD·Filed 1996·Granted Apr 28, 1998·235 cites·14 claims
- 2391US10012445B2Vapor chamber and heat pipe combined structureTAIWAN MICROLOOPS CORP·Filed 2016·Granted Jul 3, 2018·8 cites·7 claims
- 2491US9502426B1One time programming non-volatile memory cellEMEMORY TECHNOLOGY INC·Filed 2016·Granted Nov 22, 2016·13 cites·10 claims
- 2591USD629129SLED lampANTEYA TECHNOLOGY CORP·Filed 2010·Granted Dec 14, 2010·52 cites·1 claims
- 2690US10923430B2High density cross link die with polymer routing layerADVANCED MICRO DEVICES INC·Filed 2019·Granted Feb 16, 2021·6 cites·18 claims
- 2790US9502360B2Stress compensation layer for 3D packagingLIN CHUN-HUNG·Filed 2012·Granted Nov 22, 2016·12 cites·20 claims
- 2890US9159686B2Crack stopper on under-bump metallization layerCHEN YU-FENG·Filed 2012·Granted Oct 13, 2015·11 cites·20 claims
- 2990US7729606B2Lens module and digital camera module using sameHON HAI PREC IND CO LTD·Filed 2007·Granted Jun 1, 2010·14 cites·13 claims
- 3088US10483190B2Thermal conduction structrure and manufacturing method thereofTAIWAN MICROLOOPS CORP·Filed 2017·Granted Nov 19, 2019·6 cites·7 claims
- 3188US9472481B2Packages with stress-reducing structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 18, 2016·6 cites·20 claims
- 3288US8007128B2Lighting device having LED light barsANTEYA TECHNOLOGY CORP·Filed 2008·Granted Aug 30, 2011·49 cites·5 claims
- 3388US7809063B2Method and system for adaptive motion estimationSUNPLUS TECHNOLOGY CO LTD·Filed 2005·Granted Oct 5, 2010·12 cites·20 claims
- 3488US6319754B1Wafer-dicing processADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Nov 20, 2001·79 cites·1 claims
- 3588US2025158616A1Level shifterEMEMORY TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3687US8994176B2Methods and apparatus for package with interposersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 31, 2015·6 cites·20 claims
- 3787US6348399B1Method of making chip scale packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Feb 19, 2002·40 cites·8 claims
- 3886US12421347B2Manufacturing method of zwitterionic resinTAIWAN TEXTILE RES INST·Filed 2024·Granted Sep 23, 2025·0 cites·7 claims
- 3986US10459693B2Random code generator with differential cells and associated control methodEMEMORY TECHNOLOGY INC·Filed 2018·Granted Oct 29, 2019·6 cites·16 claims
- 4086US9933699B2Pellicle aging estimation and particle removal from pellicle via acoustic wavesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·3 cites·20 claims
- 4186US6534852B1Ball grid array semiconductor package with improved strength and electric performance and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 18, 2003·55 cites·10 claims
- 4285US9472524B2Copper-containing layer on under-bump metallization layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 18, 2016·4 cites·20 claims
- 4385US7560114B2Immuno-modulating antitumor activities of Ganoderma lucidum (Reishi) polysaccharidesWANG YUAN-YUAN·Filed 2007·Granted Jul 14, 2009·5 cites·7 claims
- 4485US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 4585US6383846B1Method and apparatus for molding a flip chip semiconductor deviceFiled 2000·Granted May 7, 2002·42 cites·4 claims
- 4685US6338813B1Molding method for BGA semiconductor chip packageADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jan 15, 2002·85 cites·8 claims
- 4784US7591433B2Method for controlling fan speedCOMPAL ELECTRONICS INC·Filed 2005·Granted Sep 22, 2009·15 cites·10 claims
- 4883US10126644B2Pellicle for advanced lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·2 cites·20 claims
- 4983US8253010B2Solar cell with two exposed surfaces of ARC layer disposed at different levelsLIU SHENG YUNG·Filed 2008·Granted Aug 28, 2012·5 cites·4 claims
- 5083US6211574B1Semiconductor package with wire protection and method thereforADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Apr 3, 2001·71 cites·9 claims
Showing the top 50 of 337 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →