Inventor · disambiguated record
Charles W. C. Lin
Also filed as: LIN CHARLES · LIN CHARLES W C
179 granted patents·68 pending applications·4,575 citations·filing 1988–2024
99Inventor score
Files withBRIDGE SEMICONDUCTOR CORP163LIN CHARLES W C50LIN CHARLES3ADVANCED POWER DEVICES1ADVANCED POWER DEVICES INC1
Top patents by PatentIndex Score
247 records- 0199US7750483B1Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminalBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Jul 6, 2010·109 cites·130 claims
- 0299US7262082B1Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 28, 2007·134 cites·200 claims
- 0399US6509639B1Three-dimensional stacked semiconductor packageFiled 2002·Granted Jan 21, 2003·267 cites·300 claims
- 0498US8525214B2Semiconductor chip assembly with post/base heat spreader with thermal viaLIN CHARLES W C·Filed 2011·Granted Sep 3, 2013·56 cites·36 claims
- 0598US7417314B1Semiconductor chip assembly with laterally aligned bumped terminal and fillerBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 26, 2008·65 cites·100 claims
- 0698US7268421B1Semiconductor chip assembly with welded metal pillar that includes enlarged ball bondBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Sep 11, 2007·93 cites·100 claims
- 0798US7067911B1Three-dimensional stacked semiconductor package with metal pillar in encapsulant apertureBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jun 27, 2006·161 cites·150 claims
- 0898US7009297B1Semiconductor chip assembly with embedded metal particleBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Mar 7, 2006·158 cites·110 claims
- 0998US6765287B1Three-dimensional stacked semiconductor packageFiled 2002·Granted Jul 20, 2004·247 cites·300 claims
- 1097US7538415B1Semiconductor chip assembly with bumped terminal, filler and insulative baseBRIDGE SEMICONDUCTOR CORP·Filed 2007·Granted May 26, 2009·57 cites·100 claims
- 1197US7446419B1Semiconductor chip assembly with welded metal pillar of stacked metal ballsBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Nov 4, 2008·59 cites·150 claims
- 1297US6653170B1Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuitFiled 2001·Granted Nov 25, 2003·164 cites·90 claims
- 1397US6451626B1Three-dimensional stacked semiconductor packageFiled 2001·Granted Sep 17, 2002·147 cites·90 claims
- 1496US7071573B1Semiconductor chip assembly with welded metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2004·Granted Jul 4, 2006·86 cites·230 claims
- 1596US6809414B1Semiconductor chip assembly with bumped conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Oct 26, 2004·73 cites·120 claims
- 1695US10134711B2Thermally enhanced semiconductor assembly with three dimensional integration and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Nov 20, 2018·12 cites·7 claims
- 1795US7993983B1Method of making a semiconductor chip assembly with chip and encapsulant grindingBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Aug 9, 2011·39 cites·60 claims
- 1895US6740576B1Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted May 25, 2004·105 cites·280 claims
- 1994US10804205B1Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2019·Granted Oct 13, 2020·10 cites·21 claims
- 2094US8865525B2Method of making cavity substrate with built-in stiffener and cavity substrate manufactured therebyLIN CHARLES W C·Filed 2012·Granted Oct 21, 2014·19 cites·20 claims
- 2194US8129742B2Semiconductor chip assembly with post/base heat spreader and plated through-holeLIN CHARLES W C·Filed 2011·Granted Mar 6, 2012·15 cites·60 claims
- 2294US7948076B2Semiconductor chip assembly with post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted May 24, 2011·26 cites·35 claims
- 2394US6794741B1Three-dimensional stacked semiconductor package with pillars in pillar cavitiesBRIDGE SEMICONDUCTOR CORP·Filed 2002·Granted Sep 21, 2004·77 cites·180 claims
- 2494US6350633B1Semiconductor chip assembly with simultaneously electroplated contact terminal and connection jointFiled 2000·Granted Feb 26, 2002·85 cites·50 claims
- 2594US6350386B1Method of making a support circuit with a tapered through-hole for a semiconductor chip assemblyFiled 2000·Granted Feb 26, 2002·83 cites·50 claims
- 2692US10420204B2Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted Sep 17, 2019·10 cites·2 claims
- 2792US9318411B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Apr 19, 2016·12 cites·9 claims
- 2892US8304292B1Method of making a semiconductor chip assembly with a ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Nov 6, 2012·13 cites·20 claims
- 2992US8076182B2Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the postLIN CHARLES W C·Filed 2010·Granted Dec 13, 2011·14 cites·35 claims
- 3092US7901993B2Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive traceBRIDGE SEMICONDUCTOR CORP·Filed 2010·Granted Mar 8, 2011·11 cites·35 claims
- 3192US7319265B1Semiconductor chip assembly with precision-formed metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2005·Granted Jan 15, 2008·27 cites·40 claims
- 3292US6627824B1Support circuit with a tapered through-hole for a semiconductor chip assemblyFiled 2001·Granted Sep 30, 2003·60 cites·20 claims
- 3392US6420225B1Method of fabricating power rectifier deviceAPD SEMICONDUCTOR INC·Filed 2001·Granted Jul 16, 2002·86 cites·20 claims
- 3491US10242964B1Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Mar 26, 2019·7 cites·17 claims
- 3591US8952526B2Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitryLIN CHARLES W C·Filed 2011·Granted Feb 10, 2015·9 cites·50 claims
- 3691US7494843B1Method of making a semiconductor chip assembly with thermal conductor and encapsulant grindingBRIDGE SEMICONDUCTOR CORP·Filed 2006·Granted Feb 24, 2009·23 cites·100 claims
- 3791US6576539B1Semiconductor chip assembly with interlocked conductive traceFiled 2001·Granted Jun 10, 2003·45 cites·120 claims
- 3891US6562709B1Semiconductor chip assembly with simultaneously electroplated contact terminal and connection jointFiled 2001·Granted May 13, 2003·63 cites·80 claims
- 3990US8343808B2Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitryBRIDGE SEMICONDUCTOR CORP·Filed 2011·Granted Jan 1, 2013·12 cites·37 claims
- 4090US8003415B2Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routingBRIDGE SEMICONDUCTOR CORP·Filed 2009·Granted Aug 23, 2011·18 cites·25 claims
- 4190US7190080B1Semiconductor chip assembly with embedded metal pillarBRIDGE SEMICONDUCTOR CORP·Filed 2003·Granted Mar 13, 2007·82 cites·115 claims
- 4290US6440835B1Method of connecting a conductive trace to a semiconductor chipFiled 2000·Granted Aug 27, 2002·42 cites·70 claims
- 4389US10269722B2Wiring board having component integrated with leadframe and method of making the sameBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Apr 23, 2019·5 cites·12 claims
- 4489US10211067B1Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assemblyBRIDGE SEMICONDUCTOR CORP·Filed 2018·Granted Feb 19, 2019·6 cites·18 claims
- 4589US10199321B2Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the sameBRIDGE SEMICONDUCTOR CORP·Filed 2017·Granted Feb 5, 2019·6 cites·3 claims
- 4689US9349711B2Semiconductor device with face-to-face chips on interposer and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2015·Granted May 24, 2016·6 cites·14 claims
- 4789US9209154B2Semiconductor package with package-on-package stacking capability and method of manufacturing the sameBRIDGE SEMICONDUCTOR CORP·Filed 2014·Granted Dec 8, 2015·10 cites·12 claims
- 4889US8531024B2Semiconductor chip assembly with post/base heat spreader and multilevel conductive traceLIN CHARLES W C·Filed 2011·Granted Sep 10, 2013·9 cites·35 claims
- 4989US8324653B1Semiconductor chip assembly with ceramic/metal substrateLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·20 claims
- 5089US8324723B2Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bumpLIN CHARLES W C·Filed 2010·Granted Dec 4, 2012·9 cites·65 claims
Showing the top 50 of 247 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Charles W. C. Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →