Inventor · disambiguated record
Charles W. C. Lin
Also filed as: LIN CHARLES · LIN CHARLES W C · LIN CHARLES WEN CHYANG
23 granted patents·900 citations·filing 1989–2021
97Inventor score
Top patents by PatentIndex Score
23 records- 0195US11678642B2Pet carrierDOSKOCIL MFG·Filed 2021·Granted Jun 20, 2023·3 cites·17 claims
- 0294US5167992ASelective electroless plating process for metal conductorsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Dec 1, 1992·112 cites·44 claims
- 0390US6528891B2Bumpless flip chip assembly with solder viaFiled 2001·Granted Mar 4, 2003·55 cites·40 claims
- 0488US11354729B2Systems, methods, and manufactures for applications for wearable devicesEBAY INC·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 0587US6406939B1Flip chip assembly with via interconnectionFiled 2001·Granted Jun 18, 2002·47 cites·120 claims
- 0686US5118385AMultilayer electrical interconnect fabrication with few process stepsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Jun 2, 1992·92 cites·23 claims
- 0786US5116463ADetecting completion of electroless via fillMICROELECTRONCS AND COMPUTER T·Filed 1991·Granted May 26, 1992·121 cites·37 claims
- 0885USD954356SPet carrierDOSKOCIL MFG·Filed 2020·Granted Jun 7, 2022·11 cites·1 claims
- 0985US10586274B2Applications for wearable devicesEBAY INC·Filed 2014·Granted Mar 10, 2020·5 cites·18 claims
- 1084US5358604AMethod for producing conductive patternsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Oct 25, 1994·56 cites·28 claims
- 1184US4981715AMethod of patterning electroless plated metal on a polymer substrateMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 1, 1991·58 cites·34 claims
- 1280US6437452B2Bumpless flip chip assembly with strips-in-via and platingFiled 1999·Granted Aug 20, 2002·50 cites·56 claims
- 1380US5271822AMethods and apparatus for electroplating electrical contactsMICROELECTRONICS & COMPUTER·Filed 1993·Granted Dec 21, 1993·43 cites·28 claims
- 1477US5084299AMethod for patterning electroless plated metal on a polymer substrateMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 28, 1992·43 cites·41 claims
- 1575US6448644B1Flip chip assembly with via interconnectionFiled 1998·Granted Sep 10, 2002·48 cites·78 claims
- 1671US6403400B2Bumpless flip chip assembly with strips-in-via and platingFiled 2001·Granted Jun 11, 2002·15 cites·100 claims
- 1768US6475833B2Bumpless flip chip assembly with strips and via-fillFiled 2001·Granted Nov 5, 2002·13 cites·80 claims
- 1867US5830533ASelective patterning of metallization on a dielectric substrateMICROELECTRONICS & COMPUTER·Filed 1992·Granted Nov 3, 1998·41 cites·27 claims
- 1964US6316830B1Bumpless flip chip assembly with strips and via-fillFiled 1999·Granted Nov 13, 2001·25 cites·26 claims
- 2061US4952275ACopper etching solution and methodMICROELECTRONICS & COMPUTER·Filed 1989·Granted Aug 28, 1990·11 cites·10 claims
- 2159US5192581AProtective layer for preventing electroless deposition on a dielectricMICROELECTRONICS & COMPUTER·Filed 1992·Granted Mar 9, 1993·22 cites·48 claims
- 2257US6319751B1Bumpless flip chip assembly with solder viaFiled 1999·Granted Nov 20, 2001·19 cites·68 claims
- 2341US5223110AApparatus for electroplating electrical contactsMICROELECTRONICS & COMPUTER·Filed 1991·Granted Jun 29, 1993·8 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →