Inventor · disambiguated record
Ching-Ling Lin
Also filed as: LIN CHING-LING
28 granted patents·5 pending applications·195 citations·filing 2011–2024
96Inventor score
Top patents by PatentIndex Score
33 records- 0198US9209273B1Method of fabricating metal gate structureUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 8, 2015·59 cites·20 claims
- 0296US10475709B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·16 cites·10 claims
- 0396US9263392B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 16, 2016·25 cites·24 claims
- 0495US9312356B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·13 cites·18 claims
- 0594US9748144B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·16 cites·14 claims
- 0692US9484263B1Method of removing a hard mask on a gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 1, 2016·8 cites·16 claims
- 0792US9306032B2Method of forming self-aligned metal gate structure in a replacement gate process using tapered interlayer dielectricUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 5, 2016·14 cites·13 claims
- 0892US9263540B1Metal gate structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·8 cites·5 claims
- 0988US10679903B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·4 cites·12 claims
- 1087US9324610B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 26, 2016·9 cites·18 claims
- 1187US8951918B2Method for fabricating patterned structure of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Feb 10, 2015·9 cites·20 claims
- 1285US12439681B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Oct 7, 2025·0 cites·10 claims
- 1380US9117886B2Method for fabricating a semiconductor device by forming and removing a dummy gate structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 25, 2015·5 cites·19 claims
- 1479US11972984B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 30, 2024·0 cites·9 claims
- 1572US9984974B1Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 29, 2018·1 cites·6 claims
- 1670US10892194B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 12, 2021·0 cites·20 claims
- 1770US9196500B2Method for manufacturing semiconductor structuresUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 24, 2015·2 cites·19 claims
- 1869US11569133B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 31, 2023·0 cites·2 claims
- 1969US10741455B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Aug 11, 2020·0 cites·20 claims
- 2066US9466521B2Semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 11, 2016·1 cites·8 claims
- 2166US8872286B2Metal gate structure and fabrication method thereofCHENG TSUN-MIN·Filed 2011·Granted Oct 28, 2014·3 cites·8 claims
- 2264US10607897B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 31, 2020·0 cites·10 claims
- 2362US9312121B1Method for cleaning contact hole and forming contact plug thereinUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·9 claims
- 2461US9281374B2Metal gate structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 8, 2016·1 cites·15 claims
- 2558US2025098252A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2656US2025151366A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2755US9899322B2Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·0 cites·14 claims
- 2847US9564371B2Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 7, 2017·0 cites·16 claims
- 2945US10204981B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 12, 2019·0 cites·9 claims
- 3042US2015243663A1Method for manufacturing semiconductor device and device manufactured using the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3141US2014205953A1Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 3241US2015118836A1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 3340US10312146B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →