Inventor · disambiguated record
Chun-Ling Lin
Also filed as: LIN CHUN-LING
27 granted patents·14 pending applications·282 citations·filing 2007–2025
95Inventor score
Files withUNITED MICROELECTRONICS CORP15HON HAI PREC IND CO LTD11GIANT POWER TECH BIOMEDICAL CORP3LIN CHUN-LING3WANG YU-REN2
Top patents by PatentIndex Score
41 records- 0198US7701650B2Wide-angle lens module and endoscopeHON HAI PREC IND CO LTD·Filed 2008·Granted Apr 20, 2010·137 cites·19 claims
- 0296US7443610B1Lens systemHON HAI PREC IND CO LTD·Filed 2007·Granted Oct 28, 2008·80 cites·11 claims
- 0387US7408723B1Imaging lens with high resolution and short overall lengthHON HAI PREC IND CO LTD·Filed 2007·Granted Aug 5, 2008·17 cites·10 claims
- 0483US7564634B2Lens systemHON HAI PREC IND CO LTD·Filed 2007·Granted Jul 21, 2009·12 cites·9 claims
- 0582US8598033B1Method for forming a salicide layerUNITED MICROELECTRONICS CORP·Filed 2012·Granted Dec 3, 2013·6 cites·13 claims
- 0679US7944626B2Wide angle lens module and vehicle vision systemHON HAI PREC IND CO LTD·Filed 2010·Granted May 17, 2011·4 cites·20 claims
- 0771US8551876B2Manufacturing method for semiconductor device having metal gateWANG YU-REN·Filed 2011·Granted Oct 8, 2013·5 cites·15 claims
- 0870US12237395B2High electron mobility transistor and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 0970US7626764B2Projecting lens systemHON HAI PREC IND CO LTD·Filed 2007·Granted Dec 1, 2009·5 cites·3 claims
- 1068US9966425B1Method for fabricating a MIM capacitorUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·1 cites·14 claims
- 1168US7742243B2Projection lens with high resolution and reduced overall lengthHON HAI PREC IND CO LTD·Filed 2007·Granted Jun 22, 2010·4 cites·17 claims
- 1267US7580194B2Projection lens with high resolution and reduced overall lengthHON HAI PREC IND CO LTD·Filed 2007·Granted Aug 25, 2009·4 cites·4 claims
- 1366US10153231B2Interconnect structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·1 cites·14 claims
- 1465US2025159916A1High electron mobility transistor and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1562US7796348B2Wide angle lens module and vehicle vision systemHON HAI PREC IND CO LTD·Filed 2008·Granted Sep 14, 2010·2 cites·4 claims
- 1660US9318338B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 19, 2016·1 cites·10 claims
- 1760US7440194B1Zoom lens for use in projection devicesHON HAI PREC IND CO LTD·Filed 2007·Granted Oct 21, 2008·2 cites·11 claims
- 1860US2025349765A1Semiconductor structure including hybrid bond contact and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1958US12479882B2Preparation method of setmelanotide by cyclization of disulfide bond in solid phaseCHUNGHWA CHEMICAL SYNTHESIS & BIOTECH CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 2054US8481425B2Method for fabricating through-silicon via structureLU YEN-LIANG·Filed 2011·Granted Jul 9, 2013·1 cites·17 claims
- 2150US10323332B2Electrical chemical plating processUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 18, 2019·0 cites·8 claims
- 2249US10446489B2Interconnect structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·8 claims
- 2349US9412653B2Through silicon via (TSV) processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 9, 2016·0 cites·11 claims
- 2447US9136170B2Through silicon via (TSV) structure and process thereofChen jia-jia·Filed 2012·Granted Sep 15, 2015·0 cites·8 claims
- 2545US2023263402A1Processing device and method of hemodynamic analysis for detecting a syndromeGIANT POWER TECH BIOMEDICAL CORP·Filed 2022·Application pending·0 cites
- 2645US2023218268A1Method and system for detecting location of a segment of a feeding tube inside a patientGIANT POWER TECH BIOMEDICAL CORP·Filed 2022·Application pending·0 cites
- 2745US2023263467A1Processing device and method of hemodynamic analysis for detecting a particular syndromeGIANT POWER TECH BIOMEDICAL CORP·Filed 2022·Application pending·0 cites
- 2844US9685316B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 20, 2017·0 cites·8 claims
- 2944US8691688B2Method of manufacturing semiconductor structureCHEN HSIN-YU·Filed 2012·Granted Apr 8, 2014·0 cites·17 claims
- 3044US2009052060A1Imaging lens with high resolution and short overall lengthHON HAI PREC IND CO LTD·Filed 2007·Application pending·0 cites
- 3142US10079177B1Method for forming copper material over substrateUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·0 cites·18 claims
- 3241US9416459B2Electrical chemical plating processLIN CHUN-LING·Filed 2011·Granted Aug 16, 2016·0 cites·20 claims
- 3338US2018138263A1Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3437US2013012012A1Semiconductor processLIN CHIEN-LIANG·Filed 2011·Application pending·0 cites
- 3537US2020168450A1Method for fabricating interconnect of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 3636US9000568B2Semiconductor structure and fabrication method thereofLAI SZU-HAO·Filed 2011·Granted Apr 7, 2015·0 cites·12 claims
- 3733US2013045595A1Method for processing metal layerCHENG TSUN-MIN·Filed 2011·Application pending·0 cites
- 3832US2013178063A1Method of manufacturing semiconductor device having silicon through viaLIN CHUN-LING·Filed 2012·Application pending·0 cites
- 3932US2012270389A1Method for manufacturing interconnection structure and of metal nitride layer thereofLIN CHUN-LING·Filed 2011·Application pending·0 cites
- 4030US2012306028A1Semiconductor process and structure thereofWANG YU-REN·Filed 2011·Application pending·0 cites
- 4127US2016276215A1Method for Manufacturing Semiconductor DeviceUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →