Inventor · disambiguated record
Chung-Hsien Lin
Also filed as: LIN CHUNG-HSIEN
68 granted patents·17 pending applications·433 citations·filing 1999–2025
98Inventor score
Files withINVENSENSE INC17TAIWAN SEMICONDUCTOR MFG CO LTD14TAIWAN SEMICONDUCTOR MFG12LIN CHUNG HSIEN8ASIA PACIFIC MICROSYSTEMS INC5
Top patents by PatentIndex Score
85 records- 0197US9133017B2MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 15, 2015·49 cites·20 claims
- 0296US8987059B2MEMS devices and methods of forming sameLIANG KAI-CHIH·Filed 2012·Granted Mar 24, 2015·46 cites·20 claims
- 0396US8525278B2MEMS device having chip scale packagingCHU CHIA-HUA·Filed 2011·Granted Sep 3, 2013·32 cites·19 claims
- 0493US8486744B2Multiple bonding in wafer level packagingLIN CHUNG-HSIEN·Filed 2010·Granted Jul 16, 2013·11 cites·20 claims
- 0592US8148232B2Overlay mark enhancement featureCHEN MENG-WEI·Filed 2010·Granted Apr 3, 2012·16 cites·16 claims
- 0691US8729646B2MEMS devices and methods for forming the sameCHU CHIA-HUA·Filed 2012·Granted May 20, 2014·9 cites·20 claims
- 0791US6924583B2Film bulk acoustic device with integrated tunable and trimmable deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Aug 2, 2005·95 cites·11 claims
- 0890US8716051B2MEMS device with release apertureLIN CHUNG-HSIEN·Filed 2010·Granted May 6, 2014·7 cites·18 claims
- 0988US8330559B2Wafer level packagingCHENG CHUN-WEN·Filed 2010·Granted Dec 11, 2012·6 cites·15 claims
- 1088US6737860B2System for controlling rotational speed of fan according to reference clock frequencyPROLIFIC TECHNOLOGY INC·Filed 2002·Granted May 18, 2004·51 cites·13 claims
- 1187US8569808B1Temperature stabilitized MEMSCHEN TUNG-TSUN·Filed 2012·Granted Oct 29, 2013·10 cites·13 claims
- 1285US9581512B2Pressure sensor with deformable membrane and method of manufactureINVENSENSE INC·Filed 2014·Granted Feb 28, 2017·7 cites·17 claims
- 1384US8648468B2Hermetic wafer level packagingCHU RICHARD·Filed 2010·Granted Feb 11, 2014·7 cites·18 claims
- 1484US8232614B1Package systems having a conductive element through a substrate thereof and manufacturing methods of the sameCHU CHIA-HUA·Filed 2011·Granted Jul 31, 2012·6 cites·20 claims
- 1583US11027967B2Deformable membrane and a compensating structure thereofINVENSENSE INC·Filed 2018·Granted Jun 8, 2021·3 cites·27 claims
- 1682US11225409B2Sensor with integrated heaterINVENSENSE INC·Filed 2019·Granted Jan 18, 2022·2 cites·17 claims
- 1782US8748205B1MEMS structure with adaptable inter-substrate bondTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 10, 2014·5 cites·20 claims
- 1882US8455982B2Overlay mark enhancement featureCHEN MENG-WEI·Filed 2012·Granted Jun 4, 2013·4 cites·10 claims
- 1980US9617147B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·2 cites·20 claims
- 2079US8368152B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·4 cites·20 claims
- 2177US9452924B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Sep 27, 2016·2 cites·20 claims
- 2277US9006015B2Dual layer microelectromechanical systems device and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·2 cites·20 claims
- 2377US8797127B2MEMS switch with reduced dielectric charging effectCHU CHIA-HUA·Filed 2010·Granted Aug 5, 2014·4 cites·20 claims
- 2476US8633554B2MEMS device etch stopTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 21, 2014·3 cites·13 claims
- 2575US9958349B2Pressure sensorINVENSENSE INC·Filed 2016·Granted May 1, 2018·2 cites·16 claims
- 2673US12180067B2Sensor with integrated heaterINVENSENSE INC·Filed 2021·Granted Dec 31, 2024·0 cites·13 claims
- 2772US8709849B2Wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 29, 2014·1 cites·20 claims
- 2871US10161817B2Reduced stress pressure sensorINVENSENSE INC·Filed 2014·Granted Dec 25, 2018·3 cites·22 claims
- 2969US9586811B2Semiconductor devices with moving members and methods for making the sameCHU CHIA-HUA·Filed 2011·Granted Mar 7, 2017·1 cites·20 claims
- 3068US11768122B2Liquid detection in a sensor environment and remedial action thereofINVENSENSE INC·Filed 2022·Granted Sep 26, 2023·0 cites·21 claims
- 3168US8343789B2Microstructure device with an improved anchorTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 1, 2013·2 cites·14 claims
- 3265US9134141B2Measurement deviceIND TECH RES INST·Filed 2013·Granted Sep 15, 2015·2 cites·16 claims
- 3364US11180365B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 3462US12140489B2Pressure sensor with high stabilityINVENSENSE INC·Filed 2022·Granted Nov 12, 2024·0 cites·15 claims
- 3561US11326972B2Pressure sensor with improve hermeticityINVENSENSE INC·Filed 2020·Granted May 10, 2022·0 cites·24 claims
- 3661US10457550B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 3761US2025287157A1Utilizing capacitors on a chip of a capacitive sensing deviceINVENSENSE INC·Filed 2025·Application pending·0 cites
- 3860US8887573B2MEMS vacuum level monitor in sealed packageCHEN TUNG-TSUN·Filed 2012·Granted Nov 18, 2014·1 cites·20 claims
- 3960US6244175B1Single space rotary printing press for newspapersHUEILOO CO LTD·Filed 2000·Granted Jun 12, 2001·11 cites·2 claims
- 4059US10160633B2MEMS devices and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 4159US8962367B2MEMS device with release apertureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 24, 2015·0 cites·20 claims
- 4259US2025282608A1Sealed cavity for a capacitive sensing deviceINVENSENSE INC·Filed 2024·Application pending·0 cites
- 4358US10712218B2Pressure sensorINVENSENSE INC·Filed 2019·Granted Jul 14, 2020·0 cites·22 claims
- 4458US10134552B2Method for fabricating MEMS switch with reduced dielectric charging effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 20, 2018·0 cites·20 claims
- 4558US9550666B2MEMS device with release apertureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·0 cites·20 claims
- 4658US8629517B2Wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 14, 2014·0 cites·18 claims
- 4757US10099919B2MEMS devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·0 cites·21 claims
- 4857US8410665B2MEMS kinetic energy conversionCHUNG TIEN-KAN·Filed 2010·Granted Apr 2, 2013·1 cites·14 claims
- 4956US10816422B2Pressure sensorINVENSENSE INC·Filed 2017·Granted Oct 27, 2020·0 cites·20 claims
- 5056US10087069B2Semiconductor devices with moving members and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·20 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →