Inventor · disambiguated record
Chia-Huei Lin
Also filed as: LIN CHIA-HUEI
39 granted patents·14 pending applications·135 citations·filing 2004–2025
97Inventor score
Files withUNITED MICROELECTRONICS CORP39HON HAI PREC IND CO LTD4AVISION INC3CHEN KU MING1LIN CHIA-HUEI1
Top patents by PatentIndex Score
53 records- 0197US11205609B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·7 cites·13 claims
- 0297US11205605B2Semiconductor structure with back gate and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 21, 2021·5 cites·12 claims
- 0397US10460980B2Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 29, 2019·17 cites·8 claims
- 0496US11127700B1Integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 21, 2021·4 cites·29 claims
- 0590US9213373B2Portable electronic deviceSHENZHEN TREASURE CITY TECHNOLOGY CO LTD·Filed 2014·Granted Dec 15, 2015·14 cites·20 claims
- 0689US7887042B2Separation roller and sheet separating mechanism using the sameAVISION INC·Filed 2007·Granted Feb 15, 2011·11 cites·18 claims
- 0789US7737479B2Image sensorUNITED MICROELECTRONICS CORP·Filed 2008·Granted Jun 15, 2010·15 cites·8 claims
- 0889US7547573B2Image sensor and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jun 16, 2009·15 cites·12 claims
- 0988US11133270B1Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Sep 28, 2021·2 cites·15 claims
- 1085US8274124B2Backside illuminated image sensorLIN CHIA-HUEI·Filed 2010·Granted Sep 25, 2012·7 cites·19 claims
- 1184US9499399B2Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 22, 2016·4 cites·10 claims
- 1281US7736939B2Method for forming microlenses of different curvatures and fabricating process of solid-state image sensorUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jun 15, 2010·6 cites·10 claims
- 1381US7214998B2Complementary metal oxide semiconductor image sensor layout structureUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 8, 2007·6 cites·9 claims
- 1478US8177219B2Transmission mechanism and automatic sheet feeder using the sameCHEN KU-MING·Filed 2009·Granted May 15, 2012·11 cites·20 claims
- 1578US2025324724A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1677US12382702B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 5, 2025·0 cites·9 claims
- 1777US12087712B2Method for fabricating an integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 10, 2024·0 cites·14 claims
- 1876US11658118B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 23, 2023·0 cites·1 claims
- 1975US7524592B2Optical proximity correction mask and method of fabricating color filterUNITED MICROELECTRONICS CORP·Filed 2005·Granted Apr 28, 2009·7 cites·12 claims
- 2075US2024379492A1Semiconductor structure with heat dissipation structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2173US11114562B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Sep 7, 2021·1 cites·9 claims
- 2272US11658087B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 23, 2023·0 cites·5 claims
- 2372US11652017B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 16, 2023·0 cites·5 claims
- 2472US11521891B2Semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrate and a method of making the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 6, 2022·0 cites·8 claims
- 2570US11637080B2Method for fabricating an integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 25, 2023·0 cites·15 claims
- 2670US11476192B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 18, 2022·0 cites·10 claims
- 2769US10347712B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·16 claims
- 2867US11462489B2Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 4, 2022·0 cites·15 claims
- 2966US8981501B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Mar 17, 2015·2 cites·16 claims
- 3065US11721757B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·11 claims
- 3164US11101165B2Method for fabricating semiconductor device comprising a deep trench isolation structure and a trap rich isolation structure in a substrateUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·0 cites·10 claims
- 3263US11894439B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Feb 6, 2024·0 cites·6 claims
- 3363US11848253B2Semiconductor structure with an air gapUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 19, 2023·0 cites·10 claims
- 3463US11201115B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 14, 2021·0 cites·10 claims
- 3561US12131976B2Semiconductor structure with heat dissipation structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 29, 2024·0 cites·8 claims
- 3661US10854529B2High resistivity wafer with heat dissipation structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 1, 2020·0 cites·11 claims
- 3758US12132011B2Integrated circuit device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Oct 29, 2024·0 cites·11 claims
- 3857US12249545B2Integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 11, 2025·0 cites·15 claims
- 3956US10927000B2MEMS structure with an etch stop layer buried within inter-dielectric layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 23, 2021·0 cites·7 claims
- 4056US10600734B2Transistor structure in low noise amplifierUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·0 cites·1 claims
- 4155US10679944B2Semiconductor structure with high resistivity wafer and fabricating method of bonding the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 4253US2024162093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 4351US2012149145A1Method for manufacturing image sensorYANG KUO-YUH·Filed 2010·Application pending·0 cites
- 4448US2014354431A1Electronic device and anti theft method for electronic deviceHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 4548US2021351066A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 4646US2014362509A1Electronic device with detachable tablet computerHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 4746US2014204518A1Base of electronic deviceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 4846US2014355191A1Portable electronic deviceHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 4944US2007026564A1Method for forming microlenses of different curvatures and fabricating process of solid-state image sensorWU HSIN-PING·Filed 2005·Application pending·0 cites
- 5043US2010135705A1Paper guiding mechanism and printer using the sameAVISION INC·Filed 2009·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →