Inventor · disambiguated record
Chin-Kun Lin
Also filed as: LIN CHIN-KUN
7 granted patents·3 pending applications·43 citations·filing 2002–2016
83Inventor score
Files withUNITED MICROELECTRONICS CORP6NEO BOON-TIONG2NAT CHUNG SHAN INST SCIENCE & TECH1TENG CHING-WEN1
Top patents by PatentIndex Score
10 records- 0178US7052376B1Wafer carrier gap washerUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 30, 2006·11 cites·16 claims
- 0273US9979422B1Adaptive digital pre-distortion systemNAT CHUNG SHAN INST SCIENCE & TECH·Filed 2016·Granted May 22, 2018·4 cites·5 claims
- 0371US7004820B1CMP method and device capable of avoiding slurry residuesUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 28, 2006·7 cites·5 claims
- 0469US6755726B2Polishing head with a floating knife-edgeUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jun 29, 2004·14 cites·11 claims
- 0565US7432205B2Method for controlling polishing processUNITED MICROELECTRONICS CORP·Filed 2005·Granted Oct 7, 2008·3 cites·16 claims
- 0663US8129278B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2005·Granted Mar 6, 2012·4 cites·46 claims
- 0746US2007298694A1Wafer polishing headUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0843US8759218B2Chemical mechanical polishing processNEO BOON-TIONG·Filed 2011·Granted Jun 24, 2014·0 cites·16 claims
- 0940US2008242198A1Multi-step planarizing and polishing methodUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1035US2007240734A1Method of cleaning post-cmp waferTENG CHING-WEN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →