Inventor · disambiguated record
Chih-Hao Lin
Also filed as: LIN CHIH H · LIN CHIH-HAO
84 granted patents·44 pending applications·96 citations·filing 2002–2024
98Inventor score
Files withLEXTAR ELECTRONICS CORP41LIN CHIH-HAO14TAIWAN SEMICONDUCTOR MFG CO LTD11IND TECH RES INST9WINBOND ELECTRONICS CORP9
Top patents by PatentIndex Score
128 records- 0195US11588078B2Light emitting device and moduleLEXTAR ELECTRONICS CORP·Filed 2020·Granted Feb 21, 2023·4 cites·18 claims
- 0294US11949056B2Light emitting diode packaging structureLEXTAR ELECTRONICS CORP·Filed 2023·Granted Apr 2, 2024·2 cites·10 claims
- 0393US11961951B2Light emitting diode deviceLEXTAR ELECTRONICS CORP·Filed 2021·Granted Apr 16, 2024·2 cites·13 claims
- 0492US11309433B2Non-volatile memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Apr 19, 2022·3 cites·13 claims
- 0591US9540488B1Siloxane resin composition, and photoelectric device employing the sameIND TECH RES INST·Filed 2015·Granted Jan 10, 2017·3 cites·11 claims
- 0690US8395470B2Asymmetrical planar transformer having controllable leakage inductanceLIN CHIH-HAO·Filed 2011·Granted Mar 12, 2013·10 cites·11 claims
- 0787US11011487B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·2 cites·20 claims
- 0887US8953328B2Electronic device with detachable moduleLIN CHIH-HAO·Filed 2012·Granted Feb 10, 2015·8 cites·7 claims
- 0986US10700030B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·4 cites·20 claims
- 1085US11552222B2Display deviceLEXTAR ELECTRONICS CORP·Filed 2020·Granted Jan 10, 2023·2 cites·22 claims
- 1185US9690971B2Photo-sensing unit, photo-sensing apparatus, and method for fabricating photo-sensing unitAU OPTRONICS CORP·Filed 2016·Granted Jun 27, 2017·7 cites·16 claims
- 1282US12453225B2Light emitting diode packaging structureLEXTAR ELECTRONICS CORP·Filed 2024·Granted Oct 21, 2025·0 cites·8 claims
- 1382US11101272B2DRAM and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 24, 2021·1 cites·11 claims
- 1481US12464879B2Light emitting diode deviceLEXTAR ELECTRONICS CORP·Filed 2024·Granted Nov 4, 2025·0 cites·15 claims
- 1581US9907160B2Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noiseHON HAI PREC IND CO LTD·Filed 2016·Granted Feb 27, 2018·3 cites·17 claims
- 1680US11373589B1Display with pixel devices emitting light simultaneouslyLEXTAR ELECTRONICS CORP·Filed 2021·Granted Jun 28, 2022·1 cites·20 claims
- 1776US8377813B2Split word line fabrication processREXCHIP ELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·4 cites·19 claims
- 1875US10386629B2Light-enhancement device, and appliance having the sameLEXTAR ELECTRONICS CORP·Filed 2017·Granted Aug 20, 2019·2 cites·16 claims
- 1975US9887200B2Dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2016·Granted Feb 6, 2018·2 cites·10 claims
- 2074US11088109B2Packages with multi-thermal interface materials and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 2174US9666556B2Flip chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 2274US2025107306A1Method of manufacturing display deviceLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2373US11670749B2Method for manufacturing light emitting diode packaging structureLEXTAR ELECTRONICS CORP·Filed 2022·Granted Jun 6, 2023·0 cites·12 claims
- 2473US11067608B2Current sensor and frequency compensation method thereofNOVATEK MICROELECTRONICS CORP·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 2573US10741561B2Dynamic random access memory structure including guard ring structureWINBOND ELECTRONICS CORP·Filed 2019·Granted Aug 11, 2020·1 cites·9 claims
- 2673US9617411B2Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the sameIND TECH RES INST·Filed 2015·Granted Apr 11, 2017·1 cites·29 claims
- 2771US11699673B2Semiconductor package having varying conductive pad sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·20 claims
- 2870US10453848B2Dynamic random access memory structure along with guard ring structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2017·Granted Oct 22, 2019·1 cites·11 claims
- 2969US11773222B2Curable composition and electronic device employing the sameIND TECH RES INST·Filed 2021·Granted Oct 3, 2023·0 cites·9 claims
- 3069US11652004B2Methods for forming memory devicesWINBOND ELECTRONICS CORP·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 3169US11296269B2Light emitting diode packaging structure and method for manufacturing the sameLEXTAR ELECTRONICS CORP·Filed 2020·Granted Apr 5, 2022·0 cites·10 claims
- 3269US11011431B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 18, 2021·0 cites·20 claims
- 3369US2025197553A1Polyurethane acrylate resin and resin compositionIND TECH RES INST·Filed 2023·Application pending·0 cites
- 3468US11729968B2Method for manufacturing DRAMWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 15, 2023·0 cites·7 claims
- 3568US2024218188A1Encapsulant composition and filmIND TECH RES INST·Filed 2023·Application pending·0 cites
- 3667US12202935B2Resin compound and resin composition containing the sameIND TECH RES INST·Filed 2022·Granted Jan 21, 2025·0 cites·9 claims
- 3767US8963021B2Electromagnetic interference shield and electronic device using the sameHON HAI PREC IND CO LTD·Filed 2013·Granted Feb 24, 2015·1 cites·6 claims
- 3866US12206059B2Light emitting element package including substrate with edge notch and display device including light emitting element packageLEXTAR ELECTRONICS CORP·Filed 2022·Granted Jan 21, 2025·0 cites·13 claims
- 3966US8284078B2Control method and control systemLIN CHIH-HAO·Filed 2009·Granted Oct 9, 2012·3 cites·14 claims
- 4065US11579460B2Laser despeckle device and operation method of the sameDELTA ELECTRONICS INC·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 4163US8994084B2Dynamic random access memory and method for fabricating the sameLIN CHIH-HAO·Filed 2011·Granted Mar 31, 2015·1 cites·8 claims
- 4263US7518557B2AntennaUNIV NAT TAIWAN·Filed 2007·Granted Apr 14, 2009·4 cites·17 claims
- 4362US10777467B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 4462US2025015059A1Light-emitting diode display deviceLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4561US11245026B2Memory devicesWINBOND ELECTRONICS CORP·Filed 2019·Granted Feb 8, 2022·0 cites·6 claims
- 4660US12494457B2Light-emitting diode display device and method of manufacturing the sameLEXTAR ELECTRONICS CORP·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 4759US9773958B2Optical solid state prepolymer and molding compositionIND TECH RES INST·Filed 2016·Granted Sep 26, 2017·0 cites·11 claims
- 4859US2025022854A1Micro light-emitting diode packageLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4958US12292676B2Illumination system for projectorDELTA ELECTRONICS INC·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 5058US2024355986A1Micro light-emitting diode package structure and forming method thereofLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 128 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →