Inventor · disambiguated record

Ching Ku Lin

Also filed as: LIN CHING KU

2 granted patents·0 citations·filing 2021–2022

23Inventor score

Technology areasH05K

Files withUNIMICRON TECHNOLOGY CORP2

Top patents by PatentIndex Score

2 records

0162US12396095B2Circuit board with low grain boundary density and forming method thereofUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 19, 2025·0 cites·7 claims
0252US12089347B2Method of improving wire structure of circuit board and improving wire structure of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 10, 2024·0 cites·2 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →