Inventor · disambiguated record
Chung-Shi Liu
Also filed as: LIU CHUNG · LIU CHUNG-SHI
748 granted patents·98 pending applications·7,232 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD561TAIWAN SEMICONDUCTOR MFG156LIU CHUNG-SHI16CHEN MENG-TSE15HWANG CHIEN LING15
Top patents by PatentIndex Score
846 records- 0199US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 0299US9859206B2Photoactive compound gradient photoresistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·70 cites·20 claims
- 0399US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0499US7858519B2Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layerIMEC·Filed 2008·Granted Dec 28, 2010·470 cites·16 claims
- 0598US11139249B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·6 cites·20 claims
- 0698US10490521B2Advanced structure for info wafer warpage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 26, 2019·43 cites·20 claims
- 0798US10354964B2Integrated devices in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·21 cites·20 claims
- 0898US10157849B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·54 cites·20 claims
- 0998US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 1098US9659805B2Fan-out interconnect structure and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·20 cites·20 claims
- 1198US9418971B2Package-on-package structure including a thermal isolation material and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 16, 2016·42 cites·20 claims
- 1298US9263839B2System and method for an improved fine pitch jointTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·69 cites·17 claims
- 1398US9257333B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·77 cites·20 claims
- 1498US9196559B2Directly sawing wafers covered with liquid molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·61 cites·19 claims
- 1598US8912651B2Package-on-package (PoP) structure including stud bulbs and methodYU CHEN-HUA·Filed 2012·Granted Dec 16, 2014·41 cites·16 claims
- 1698US6181013B1Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured therebyTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jan 30, 2001·197 cites·18 claims
- 1797US12057359B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 1897US11798925B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
- 1997US11417698B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 2097US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 2197US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 2297US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 2397US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 2497US9484227B1Dicing in wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·20 cites·20 claims
- 2597US9373604B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·17 cites·20 claims
- 2697US9318429B2Integrated structure in wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·32 cites·20 claims
- 2797US9093337B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·27 cites·20 claims
- 2897US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 2997US8381965B2Thermal compress bondingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 26, 2013·30 cites·14 claims
- 3097US8324738B2Self-aligned protection layer for copper post structureLIU CHUNG-SHI·Filed 2010·Granted Dec 4, 2012·26 cites·20 claims
- 3197US6010962ACopper chemical-mechanical-polishing (CMP) dishingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 4, 2000·339 cites·47 claims
- 3296US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 3396US11848319B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 3496US11506843B1Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·5 cites·20 claims
- 3596US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 3696US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 3796US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 3896US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 3996US9761522B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·19 cites·20 claims
- 4096US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
- 4196US9601353B2Packages with molding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·28 cites·19 claims
- 4296US9570410B1Methods of forming connector pad structures, interconnect structures, and structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·11 cites·20 claims
- 4396US9018758B2Cu pillar bump with non-metal sidewall spacer and metal top capHWANG CHIEN LING·Filed 2010·Granted Apr 28, 2015·28 cites·20 claims
- 4496US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 4596US8492891B2Cu pillar bump with electrolytic metal sidewall protectionLU WEN-HSIUNG·Filed 2010·Granted Jul 23, 2013·43 cites·20 claims
- 4696US8441124B2Cu pillar bump with non-metal sidewall protection structureWU YI-WEN·Filed 2010·Granted May 14, 2013·25 cites·20 claims
- 4796US8258055B2Method of forming semiconductor dieHWANG CHIEN LING·Filed 2010·Granted Sep 4, 2012·38 cites·16 claims
- 4896US8104666B1Thermal compressive bonding with separate die-attach and reflow processesHWANG CHIEN LING·Filed 2010·Granted Jan 31, 2012·29 cites·18 claims
- 4996US6271136B1Multi-step plasma process for forming TiSiN barrierTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Aug 7, 2001·128 cites·39 claims
- 5096US6136680AMethods to improve copper-fluorinated silica glass interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 24, 2000·133 cites·35 claims
Showing the top 50 of 846 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →