Inventor · disambiguated record
Chenglin Liu
Also filed as: LIU CHENGLIN
59 granted patents·9 pending applications·240 citations·filing 2006–2024
98Inventor score
Files withTENCENT TECH SHENZHEN CO LTD26MARVELL INT LTD10LIU CHENGLIN9MARVELL WORLD TRADE LTD8KE COM BEIJING TECH CO LTD2
Top patents by PatentIndex Score
68 records- 0197US8022522B1Semiconductor packageMARVELL INT LTD·Filed 2006·Granted Sep 20, 2011·42 cites·11 claims
- 0297US7675157B2Thermal enhanced packageMARVELL WORLD TRADE LTD·Filed 2006·Granted Mar 9, 2010·55 cites·19 claims
- 0392US7957094B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2010·Granted Jun 7, 2011·8 cites·11 claims
- 0491US11620730B2Method for merging multiple images and post-processing of panoramaREALSEE BEIJING TECH CO LTD·Filed 2021·Granted Apr 4, 2023·3 cites·20 claims
- 0591US10878413B2Method, server, and storage medium for verifying transactions using a smart cardTENCENT TECH SHENZHEN CO LTD·Filed 2016·Granted Dec 29, 2020·9 cites·17 claims
- 0691US8673687B1Etched hybrid die packageLIU CHENGLIN·Filed 2010·Granted Mar 18, 2014·12 cites·19 claims
- 0789US8581374B1Placing heat sink into packaging by strip formation assemblyCHEN CHENDER·Filed 2011·Granted Nov 12, 2013·11 cites·19 claims
- 0889US8482112B1Semiconductor packageLIOU SHIANN-MING·Filed 2011·Granted Jul 9, 2013·8 cites·16 claims
- 0988US9565263B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Feb 7, 2017·7 cites·20 claims
- 1087US11282762B2Heat sink design for flip chip ball grid arrayMARVELL ASIA PTE LTD·Filed 2020·Granted Mar 22, 2022·2 cites·22 claims
- 1187US9224677B1Semiconductor packageMARVELL INT LTD·Filed 2013·Granted Dec 29, 2015·6 cites·14 claims
- 1287US7764462B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2006·Granted Jul 27, 2010·9 cites·12 claims
- 1383US11025680B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2018·Granted Jun 1, 2021·2 cites·20 claims
- 1483US10165017B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Dec 25, 2018·4 cites·14 claims
- 1583US9265077B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Feb 16, 2016·5 cites·20 claims
- 1682US9949120B2Methods and systems for enabling communication with a receiver device in a networkTENCENT TECH SHENZHEN CO LTD·Filed 2016·Granted Apr 17, 2018·4 cites·19 claims
- 1782US8218261B1Thermal solution for drive systems such as hard disk drives and digital versatile discsLIU CHENGLIN·Filed 2011·Granted Jul 10, 2012·3 cites·10 claims
- 1880US9666510B2Dual row quad flat no-lead semiconductor packageMARVELL WORLD TRADE LTD·Filed 2016·Granted May 30, 2017·3 cites·19 claims
- 1980US9444902B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Sep 13, 2016·4 cites·18 claims
- 2079US8355221B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2012·Granted Jan 15, 2013·2 cites·12 claims
- 2177US8999755B1Etched hybrid die packageMARVELL INT LTD·Filed 2014·Granted Apr 7, 2015·3 cites·18 claims
- 2275US7911053B2Semiconductor packaging with internal wiring busMARVELL WORLD TRADE LTD·Filed 2008·Granted Mar 22, 2011·5 cites·15 claims
- 2374US10061400B2Input device and control systemTENCENT TECH SHENZHEN CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·14 claims
- 2474US9614923B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 2574US9179270B2Intercommunication methods and devices based on digital networksTENCENT TECH SHENZHEN CO LTD·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 2674US8518742B1Semiconductor packaging with internal wiring busLIU CHENGLIN·Filed 2011·Granted Aug 27, 2013·3 cites·10 claims
- 2773US9313289B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Apr 12, 2016·2 cites·17 claims
- 2873US8848313B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2013·Granted Sep 30, 2014·1 cites·12 claims
- 2973US7969022B1Die-to-die wire-bondingMARVELL INT LTD·Filed 2008·Granted Jun 28, 2011·5 cites·7 claims
- 3072US9872318B2Method and device for controlling peripheral devices via a social networking platformTENCENT TECH SHENZHEN CO LTD·Filed 2014·Granted Jan 16, 2018·2 cites·18 claims
- 3172US9064784B1Ball grid array package with laser vias and methods for making the sameLIU CHENGLIN·Filed 2010·Granted Jun 23, 2015·4 cites·10 claims
- 3270US9288909B2Ball grid array package substrate with through holes and method of forming sameMARVELL WORLD TRADE LTD·Filed 2013·Granted Mar 15, 2016·2 cites·15 claims
- 3368US9425139B2Dual row quad flat no-lead semiconductor packageMARVELL WORLD TRADE LTD·Filed 2013·Granted Aug 23, 2016·2 cites·18 claims
- 3467US2024286916A1Method for integrated utilization of calcium chloride solution and carbon dioxideUNIV EAST CHINA SCIENCE & TECH·Filed 2024·Application pending·0 cites
- 3566US8357568B2Thermal enhanced packageMARVELL INT TECHNOLOGY LTD·Filed 2009·Granted Jan 22, 2013·2 cites·20 claims
- 3665US11721006B2Method and device for generating virtual reality dataREALSEE BEIJING TECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·19 claims
- 3765US11055835B2Method and device for generating virtual reality dataKE COM BEIJING TECH CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·24 claims
- 3865US9918250B2Data communication via data packet headersTENCENT TECH SHENZHEN CO LTD·Filed 2015·Granted Mar 13, 2018·1 cites·20 claims
- 3964US8741694B1Placing heat sink into packaging by strip formation assemblyMARVELL INT LTD·Filed 2013·Granted Jun 3, 2014·1 cites·18 claims
- 4064US2025250177A1Preparation method for silicon dioxide, and toothpasteJINSANJIANG ZHAOQING SILICON MAT CO LTD·Filed 2024·Application pending·0 cites
- 4162US11640605B2Method, server, and storage medium for verifying transactions using a smart cardTENCENT TECH SHENZHEN CO LTD·Filed 2020·Granted May 2, 2023·0 cites·20 claims
- 4254US10412061B2Method and system for encrypted communicationsTENCENT TECH SHENZHEN CO LTD·Filed 2018·Granted Sep 10, 2019·0 cites·18 claims
- 4353US8900932B2Thermal enhanced packageLIU CHENGLIN·Filed 2012·Granted Dec 2, 2014·0 cites·21 claims
- 4452US10542458B2Data communication via data packet headersTENCENT TECH SHENZHEN CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·20 claims
- 4552US10165446B2Methods and systems for enabling communication with a receiver device in a networkTENCENT TECH SHENZHEN CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 4652US8294248B2Chip on leadsLIU CHENGLIN·Filed 2007·Granted Oct 23, 2012·0 cites·13 claims
- 4752US2021365603A1Artificial intelligence systems and methods for interior furnishingKE COM BEIJING TECH CO LTD·Filed 2021·Application pending·0 cites
- 4851US10657582B2Method, user terminal, and service terminal for processing service dataTENCENT TECH SHENZHEN CO LTD·Filed 2017·Granted May 19, 2020·0 cites·20 claims
- 4950US8809118B2Chip on leadsMARVELL WORLD TRADE LTD·Filed 2012·Granted Aug 19, 2014·0 cites·14 claims
- 5049US11270190B2Method and apparatus for generating target neural network structure, electronic device, and storage mediumBEIJING SENSETIME TECH DEVELOPMENT CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·20 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chenglin Liu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →