Inventor · disambiguated record

Chia-Wei Liu

Also filed as: LIU CHIA-WEI

76 granted patents·37 pending applications·152 citations·filing 1998–2025

98Inventor score

Technology areasH10W H10P H04W H01Q H10N

Files withTAIWAN SEMICONDUCTOR MFG CO LTD64 NETGEAR INC17 UNITED MICROELECTRONICS CORP8 FU TAI HUA IND SHENZHEN CO LTD5 HON HAI PREC IND CO LTD4

Top patents by PatentIndex Score

113 records

0194US9516540B2Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bandsNETGEAR INC·Filed 2013·Granted Dec 6, 2016·10 cites·5 claims
0294US9439099B2Systems and methods for simultaneously using multiple WLAN modules operating in different wireless bandsNETGEAR INC·Filed 2013·Granted Sep 6, 2016·9 cites·4 claims
0393US11489011B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·4 cites·20 claims
0491US9402199B2Systems and methods for wireless load balancing and channel selection for a wireless device using WLAN modules operating simultaneously in different wireless bandsNETGEAR INC·Filed 2013·Granted Jul 26, 2016·6 cites·20 claims
0590US10679889B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·5 cites·20 claims
0689US9923581B2Front-end module and antenna design for a wireless device simultaneously using WLAN modules operating in different wireless bandsNETGEAR INC·Filed 2013·Granted Mar 20, 2018·5 cites·21 claims
0787US12396179B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
0887USD844126SDehumidifierHON HAI PREC IND CO LTD·Filed 2018·Granted Mar 26, 2019·30 cites·1 claims
0987US2025344405A1Novel resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1086US11772962B1MEMS package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·1 cites·20 claims
1186US2025364396A1Variable graduated capacitor structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1285US2025361139A1Impact-resistant micromechanical armsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1384US12178136B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Dec 24, 2024·0 cites·9 claims
1483US12243839B2Bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2024·Granted Mar 4, 2025·0 cites·17 claims
1583US11011576B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
1683US2025079363A1Bonded semiconductor structure utilizing concave/convex profileUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1782US9281336B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·2 cites·20 claims
1882US7301185B2High-voltage transistor device having an interlayer dielectric etch stop layer for preventing leakage and improving breakdown voltageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 27, 2007·34 cites·11 claims
1981US2025072294A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
2080US9177914B2Metal pad structure over TSV to reduce shorting of upper metal layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 3, 2015·5 cites·20 claims
2179US12400947B2Variable graduated capacitor structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
2279US12165868B2Semiconductor device in a containment structure including a buried layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
2379US2025132258A1Plasma-damage-resistant interconnect structure and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2478US12205901B2Plasma-damage-resistant interconnect structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
2578US12131915B2Pit-less chemical mechanical planarization process and device structures made therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
2678US11950433B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
2778US11935854B2Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 19, 2024·0 cites·6 claims
2878US9948326B2Systems and methods for implementing a wireless device that supports WLAN modules operating simultaneously in different wireless bandsNETGEAR INC·Filed 2016·Granted Apr 17, 2018·1 cites·17 claims
2978US2024395739A1Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3078US2025062119A1Semiconductor buried layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3178US2024379379A1Pit-less chemical mechanical planarization process and device structures made therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3277US12237280B2Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
3377US10236578B2Antenna structures and associated methods for construction and useNETGEAR INC·Filed 2017·Granted Mar 19, 2019·2 cites·22 claims
3477US2022384503A1Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3575US12448279B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
3674US12415718B2Impact-resistant micromechanical armsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
3774US11621731B2Client wireless device that merges functions of upper and lower MAC layers to support WLAN modules operating simultaneously in different wireless bandsNETGEAR INC·Filed 2020·Granted Apr 4, 2023·0 cites·14 claims
3874US2024339366A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3974US2024387262A1Metal interconnect structures and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4073US11640949B2Bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 2, 2023·0 cites·7 claims
4173US10438838B2Semiconductor structure and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 8, 2019·1 cites·20 claims
4272US11848291B2Cavity resonator for enhancing radio-frequency performance and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
4372US9425516B2Compact dual band GNSS antenna designUNIV OHIO STATE·Filed 2013·Granted Aug 23, 2016·3 cites·22 claims
4471US12453298B2Resistive random access memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
4571US11778917B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 3, 2023·0 cites·7 claims
4671US11710632B2Method of manufacturing at least one semiconductor device on or in a base semiconductor material disposed in a containment structure including a buried layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
4770US11728272B2Plasma-damage-resistant interconnect structure and methods for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
4870US11587824B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
4970US2024086137A1Near eye display apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
5069US12261129B2Damping device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims

Showing the top 50 of 113 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →